Thermo-haptics for a pointing device for gaming

ABSTRACT

An information handling system may include a processor, a data storage device, a power management unit, a thermo-haptic mouse, including an array of thermoelectric generators of a thermo-haptic module to selectively heat or cool a portion of the thermo-haptic mouse to be felt by a user of the thermo-haptic mouse, and a piezoelectric actuator of the thermo-haptic module to selectively apply a vibration to the portions of the thermo-haptic mouse to be felt by the user of the thermo-haptic mouse, and the processor executing code of a mouse training machine learning system to: receive, as training input, captured images during the execution of a gaming application and provide, as output, image recognition dataset descriptive of recognized game action event environmental data during execution of the gaming application, the image recognition dataset to be used by the processor executing a thermo-haptic feedback model evaluation system to provide thermo-haptic signals to the array of thermoelectric generators and the piezoelectric actuator to provide thermo-haptic feedback commensurate with the game action event environment during game play.

FIELD OF THE DISCLOSURE

The present disclosure generally relates to immersive gaming platformexperiences. The present disclosure more specifically relates to thermaland vibrational haptic feedback to a user during operation of aninformation handling system.

BACKGROUND

As the value and use of information continues to increase, individualsand businesses seek additional ways to process and store information.One option available to clients is information handling systems. Aninformation handling system generally processes, compiles, stores,and/or communicates information or data for business, personal, or otherpurposes thereby allowing clients to take advantage of the value of theinformation. Because technology and information handling may varybetween different clients or applications, information handling systemsmay also vary regarding what information is handled, how the informationis handled, how much information is processed, stored, or communicated,and how quickly and efficiently the information may be processed,stored, or communicated. The variations in information handling systemsallow for information handling systems to be general or configured for aspecific client or specific use, such as e-commerce, financialtransaction processing, airline reservations, enterprise data storage,or global communications. In addition, information handling systems mayinclude a variety of hardware and software components that may beconfigured to process, store, and communicate information and mayinclude one or more computer systems, data storage systems, andnetworking systems. The information handling system may includetelecommunication, network communication, and video communicationcapabilities. The information handling system may be used to executeinstructions of one or more gaming applications. Further, theinformation handling system may include a mouse or other pointing deviceused by the user to provide input to the information handling system.

BRIEF DESCRIPTION OF THE DRAWINGS

It will be appreciated that for simplicity and clarity of illustration,elements illustrated in the Figures are not necessarily drawn to scale.For example, the dimensions of some elements may be exaggerated relativeto other elements. Embodiments incorporating teachings of the presentdisclosure are shown and described with respect to the drawings herein,in which:

FIG. 1 is a block diagram illustrating an information handling systemaccording to an embodiment of the present disclosure;

FIG. 2 is a block diagram illustrating an information handling systemand a thermo-haptic mouse according to an embodiment of the presentdisclosure;

FIG. 3 is a side, partial cut-away view of a thermo-haptic mouseaccording to an embodiment of the present disclosure;

FIG. 4 is a side, cut-away view of a thermo-haptic mouse according to anembodiment of the present disclosure;

FIG. 5 is a perspective, cut-away view of a thermo-haptic mouseaccording to an embodiment of the present disclosure;

FIG. 6 is a perspective, cut-away view of a thermo-haptic mouseaccording to an embodiment of the present disclosure;

FIG. 7 is a perspective view of a thermoelectric generator according toan embodiment of the present disclosure;

FIG. 8 is a flow diagram illustrating a method of activating athermo-haptic mouse according to an embodiment of the presentdisclosure;

FIG. 9 is a flow diagram illustrating a method of training a machinelearning system to control the activation of a thermo-haptic mouseaccording to an embodiment of the present disclosure; and

FIG. 10 is a flow diagram illustrating a method of tracking action on ascreen during game play to control the activation of one or more TEGarrays and PEAs of a thermo-haptic mouse according to an embodiment ofthe present disclosure.

The use of the same reference symbols in different drawings may indicatesimilar or identical items.

DETAILED DESCRIPTION OF THE DRAWINGS

The following description in combination with the Figures is provided toassist in understanding the teachings disclosed herein. The descriptionis focused on specific implementations and embodiments of the teachings,and is provided to assist in describing the teachings. This focus shouldnot be interpreted as a limitation on the scope or applicability of theteachings.

Embodiments of the present disclosure provide for an informationhandling system, that includes a processor, a data storage device, and apower management unit, used to control the actuation of a thermo-hapticmouse. In an embodiment, the thermo-haptic mouse may include an array ofthermoelectric generators (TEG array) of a thermo-haptic module toselectively heat or cool a portion of the thermo-haptic mouse to be feltby a user of the thermo-haptic mouse. In an embodiment, thethermo-haptic mouse may include a piezoelectric actuator (PEA) of thethermo-haptic module to selectively apply a vibration to the portions ofthe thermo-haptic mouse to be felt by the user of the thermo-hapticmouse. The TEG array and PEA may be operatively coupled together to formthe thermo-haptic module. In an embodiment, the information handlingsystem may include a mouse training machine learning system to receive,as training input, captured images during the execution of a gamingapplication and provide, as output, image recognition datasetdescriptive of recognized game action event environmental data duringexecution of the gaming application, the image recognition dataset to beused by the processor executing a thermo-haptic feedback modelevaluation system to provide thermo-haptic signals to the array ofthermoelectric generators and the piezoelectric actuator to providethermo-haptic feedback commensurate with the game action environmentduring game play.

In an embodiment, the information handling system may, with theexecution of the thermo-haptic feedback model evaluation system by theprocessor, determine if a threshold accuracy of the output imagerecognition dataset has been reached before use of the output imagerecognition dataset by the processor for thermo-haptic feedback duringexecution of the gaming application. Where the accuracy threshold is notreached, the processor may iteratively reevaluate the accuracy ofadditional image recognition datasets until the accuracy of the imagerecognition dataset has reached the accuracy threshold. Where theaccuracy threshold is reached, the processor may load, and execute therecognition dataset with the processor during game play and activate thearray of thermoelectric generators and piezoelectric actuators viagenerated thermoelectric feedback signals or haptic feedback signals.

In an embodiment, the array of thermoelectric generators may be arrangedwithin an interior of a portion of the thermo-haptic mouse to provide aplurality of hot and cold thermal zones across a surface of thethermo-haptic mouse to be touched by the user. In an embodiment, thethermoelectric generators may include a flexible substrate to allow thearray of thermoelectric generators to contour against an interiorsurface of a housing of the thermo-haptic mouse to be held by the user,the flexible substrate being made of polyimide. In an embodiment, apairing of a piezoelectric actuator to each thermoelectric generator maybe made with the piezoelectric actuators being placed below thethermoelectric generators sandwiching the thermoelectric generatorsbetween the piezoelectric actuators and an interior surface of a housingof the thermo-haptic mouse.

In an embodiment, the thermo-haptic mouse may further comprise adedicated printed circuit board including a thermoelectric driver forthe array of thermoelectric generators and a piezoelectric actuatordriver for a plurality of piezoelectric actuators. In an embodiment, thethermoelectric drivers and piezoelectric drivers may be operativelycoupled to a controller on a mouse printed circuit board to receive thesignals. In an embodiment, each thermoelectric generator may furthercomprise a series of p-doped and n-doped semiconductors to receive avoltage from the power management unit to selectively cool one or moreof the semiconductors.

The present specification further describes a thermo-haptic feedbackpointing device operatively coupled to an information handling system.The thermo-haptic feedback pointing device may include at least oneinput button, a housing including a palm rest housing, and a motiontracking system to track movement of the thermo-haptic feedback pointingdevice. Further, the thermo-haptic feedback device may include acontroller for operating motion tracking, button selection, scroll wheelor other scroll function, and other aspects of a mouse pointing devicein the embodiments described herein. The thermo-haptic feedback pointingdevice may further include a controller to receive output data from aprocessor of the information handling system. In an embodiment, thethermo-haptic feedback pointing device may include a thermoelectricdriver operatively coupled to an array of thermoelectric generatorelements to receive signals from the controller to selectively heat orcool portions of the thermo-haptic feedback pointing device to be feltby the user of the thermo-haptic feedback pointing device, the pluralityof thermoelectric generators including a flexible substrate to allow theplurality of thermoelectric generators to contour against an interiorsurface of the palm rest housing of the thermo-haptic feedback pointingdevice. The thermo-haptic feedback pointing device may also include apiezoelectric driver operatively coupled to a piezoelectric actuator toselectively apply a vibration to the portions of the thermo-hapticfeedback pointing device to be felt by the user of the thermo-hapticfeedback pointing device. In an embodiment, the thermo-haptic feedbackpointing device receives instructions to activate the piezoelectricactuator and array of thermoelectric generators originating from ahaptic feedback machine learning system.

In an embodiment, the thermo-haptic feedback pointing device may includepairing of a piezoelectric actuator to each array of thermoelectricgenerators, the piezoelectric actuator being placed below each array ofthermoelectric generators sandwiching the array of thermoelectricgenerators between the piezoelectric actuator and an interior surface ofthe palm rest housing of the thermo-haptic feedback pointing device. Inan embodiment, the thermo-haptic feedback pointing device may include adedicated printed circuit board including a plurality of thermoelectricdrivers for each of the array of thermoelectric generators to render athermo-haptic feedback across a plurality of arrays of thermoelectricgenerators.

In an embodiment, the thermo-haptic feedback pointing device may includea dedicated printed circuit board including a plurality of piezoelectricactuator drivers for each of a plurality of piezoelectric actuators torender a vibration haptic feedback across a plurality of piezoelectricactuators.

In an embodiment, the thermo-haptic feedback pointing device may includea wired connection with the information handling system, the wiredconnection including signal and power lines to the controller of thethermo-haptic feedback pointing device. In an embodiment, thethermo-haptic feedback pointing device may include a wirelesstransceiver to send and receive data from the information handlingsystem and a battery to power the controller, thermoelectric generators,and piezoelectric actuators.

The thermo-haptic feedback pointing device, in an embodiment, mayinclude forming various heat and cold zones on a surface the housing ofthe thermo-haptic feedback pointing device by arranging a plurality ofthermoelectric generators against the interior surface of a palm resthousing of the thermo-haptic feedback pointing device to concurrentlyheat or cool one or more of the heat and cold zones.

The present specification further describes a thermo-haptic feedbackpointing device operatively coupled to an information handling systemthat includes at least one input button, a housing including a palm resthousing, and a motion tracking system to track movement of thethermo-haptic feedback pointing device. The thermo-haptic feedbackpointing device may further include a controller to send input data orto receive output data from a processor of the information handlingsystem. The thermo-haptic feedback pointing device may also include, inan embodiment, a thermoelectric driver operatively coupled to an arrayof thermoelectric generator to receive signals from the controller toselectively heat or cool portions of the thermo-haptic feedback pointingdevice to be felt by the user of the thermo-haptic feedback pointingdevice, the plurality of thermoelectric generators including a flexiblesubstrate to allow the plurality of thermoelectric generators to contouragainst an interior surface of the palm rest housing of thethermo-haptic feedback pointing device. In an embodiment, thethermo-haptic feedback pointing device may include a piezoelectricdriver operatively coupled to a piezoelectric actuator to selectivelyapply a vibration to the portions of the thermo-haptic feedback pointingdevice to be felt by the user of the thermo-haptic feedback pointingdevice.

In an embodiment, the thermo-haptic feedback pointing device may includea dedicated printed circuit board including a plurality ofthermoelectric drivers for each of the array of thermoelectricgenerators to render a thermo-haptic feedback across a plurality ofarrays of thermoelectric generators and a plurality of piezoelectricactuator drivers for each of a plurality of piezoelectric actuators torender a vibration haptic feedback across a plurality of piezoelectricactuators.

In an embodiment, the thermo-haptic feedback pointing device may includepairing of a piezoelectric actuator to each array of thermoelectricgenerators, the piezoelectric actuator being placed below each array ofthermoelectric generators sandwiching the array of thermoelectricgenerators between the piezoelectric actuator and an interior surface ofthe palm rest housing of the thermo-haptic feedback pointing device. Thethermo-haptic feedback pointing device may, in an embodiment, furtherinclude a wired connection with the information handling system, thewired connection including signal and power lines to the controller ofthe thermo-haptic feedback pointing device. In an embodiment, thethermo-haptic feedback pointing device may include a wirelesstransceiver to send and receive data from the information handlingsystem and a battery to power the controller, thermoelectric generators,and piezoelectric actuators.

In an embodiment, the thermo-haptic feedback pointing device may includediscrete heating or cold zones formed on a surface of the palm resthousing of the thermo-haptic feedback pointing device by arranging theplurality of thermoelectric generators against an interior surface ofthe housing of the thermo-haptic feedback pointing device toconcurrently heat or cool one or more of the discrete hot and coldzones. In an embodiment, the thermo-haptic feedback pointing devicereceives instructions to activate the piezoelectric actuator and arrayof thermoelectric generators originating from a haptic feedback machinelearning system. In another embodiment, the thermo-haptic feedbackpointing device may receive instructions to activate piezoelectricactuator and array of thermoelectric generators originating from thegaming application itself.

In the present specification and in the appended claims the term “hapticfeedback” is meant to be understood as output to a user that include theapplication of mechanical haptic forces and changes in temperatures tothe user. In the context of the embodiments of the thermo-hapticfeedback pointing device described herein, a thermoelectric generator(TEG) may provide the changes in temperature felt by a user as the usertouches the thermo-haptic feedback pointing device. Additionally, in thecontext of the embodiments of the thermo-haptic feedback pointingdevice, a piezoelectric actuator (PEA) may be used to provide mechanicalforce such as a vibration at the thermo-haptic feedback pointing devicesuch that the user feels that haptic motion when the user touches thethermo-haptic feedback pointing device. Such haptic motion may bevibration, clicks, bumps, pulsed motion, motion of varying intensity,among others.

FIG. 1 illustrates an information handling system 100 similar to theinformation handling systems according to several aspects of the presentdisclosure. In the embodiments described herein, an information handlingsystem includes any instrumentality or aggregate of instrumentalitiesoperable to compute, classify, process, transmit, receive, retrieve,originate, switch, store, display, manifest, detect, record, reproduce,handle, or use any form of information, intelligence, or data forbusiness, scientific, control, entertainment, or other purposes. Forexample, an information handling system 100 can be a personal computer,mobile device (e.g., personal digital assistant (PDA) or smart phone),server (e.g., blade server or rack server), a consumer electronicdevice, a network server or storage device, a network router, switch, orbridge, wireless router, or other network communication device, anetwork connected device (cellular telephone, tablet device, etc.), IoTinformation handling system, wearable information handling system, aset-top box (STB), a mobile information handling system, a palmtopcomputer, a laptop computer, a desktop computer, a communicationsdevice, an access point (AP), a base station transceiver, a wirelesstelephone, a control system, a camera, a scanner, a facsimile machine, aprinter, a pager, a personal trusted device, a web appliance, or anyother suitable machine capable of executing a set of instructions(sequential or otherwise) that specify actions to be taken by thatmachine, and can vary in size, shape, performance, price, andfunctionality.

In an example embodiment, the information handling system 100 mayinclude a laptop or desktop gaming system that executes a gamingapplication. The gaming application may include any computer code thatis executed by a processor 102 of the information handling system 100 inorder to allow the user to engage with a gaming environment viainput/output (I/O) devices 112 such as the thermo-haptic mouse 116, akeyboard 114, a video/graphics display device 110 or any other input oroutput device. The thermo-haptic mouse 116, as described herein, mayfurther provide haptic feedback to the user in order to further immersethe user into the action presented to the user via the execution of thegaming application. This haptic feedback may originate from theselective activation of one or more TEG arrays 134-1, 134-2, 134-3 thatheat at or cool a portion of a housing of the thermo-haptic mouse 116. ATEG array 134-1, 134-2, 134-3 may include a two or more TEGs that, inthe embodiments herein, include a p-doped and n-doped semiconductorsandwiched between a top electric insulator and bottom electricinsulator both made of, for example, a ceramic. In the presentspecification and in the appended claims, a TEG array 134-1, 134-2,134-3 is defined as a group of TEGs that may or may not be coupled inseries.

Additional haptic feedback may originate from the selective activationof one or more PEAs 138-1, 138-2, 138-n that produce vibrations againstthe portion of the housing. These types of haptic feedback may becoordinated with actions conducted in the gaming environment displayedon the video/graphics display device 110 during execution of the gamingapplication. Various example gaming environments may result in how theTEG arrays 134-1, 134-2, 134-3 and PEAs 138-1, 138-2, 138-n provide thehaptic feedback to the user through the thermo-haptic mouse 116. Detailsof the activation of the TEG arrays 134-1, 134-2, 134-3 and PEAs 138-1,138-2, 138-n based on the gaming environment are described in moredetail herein.

In a networked deployment, the information handling system 100 mayoperate in the capacity of a server or as a client computer in aserver-client network environment, or as a peer computer system in apeer-to-peer (or distributed) network environment. In a particularembodiment, the information handling system 100 can be implemented usingelectronic devices that provide voice, video, or data communication. Forexample, an information handling system 100 may be any mobile or otherinformation handling system capable of executing a set of instructions(sequential or otherwise) that specify actions to be taken by thatmachine. Further, while a single information handling system 100 isillustrated, the term “system” shall also be taken to include anycollection of systems or sub-systems that individually or jointlyexecute a set, or multiple sets, of instructions to perform one or morecomputer functions.

The information handling system can include memory (volatile (e.g.random-access memory, etc.), nonvolatile (read-only memory, flash memoryetc.) or any combination thereof), one or more processing resources,such as a central processing unit (CPU) such as processor 102, agraphics processing unit (GPU), hardware or software control logic, orany combination thereof. Additional components of the informationhandling system 100 can include one or more storage devices, one or morecommunications ports for communicating with external devices, as wellas, various input and output (I/O) devices 112, such as the keyboard114, the thermo-haptic mouse 116, a video/graphics display device 110,or any combination thereof. The information handling system 100 can alsoinclude one or more buses operable to transmit communications betweenthe various hardware components. Portions of an information handlingsystem 100 may themselves be considered information handling systems100.

Information handling system 100 can include devices or modules thatembody one or more of the devices or execute instructions for the one ormore systems and modules described herein, and operates to perform oneor more of the methods described herein. The information handling system100 may execute code instructions 124 that may operate on servers orsystems, remote data centers, or on-box in individual client informationhandling systems according to various embodiments herein. In someembodiments, it is understood any or all portions of code instructions124 may operate on a plurality of information handling systems 100.

The information handling system 100 may include a processor 102 such asa central processing unit (CPU), control logic or some combination ofthe same. Any of the processing resources may operate to execute codethat is either firmware or software code. Moreover, the informationhandling system 100 can include memory such as main memory 104, staticmemory 106, computer readable medium 122 storing instructions 124 of thehaptic mouse feedback machine learning system 146, and gamingapplication, and drive unit 116 (volatile (e.g. random-access memory,etc.), nonvolatile (read-only memory, flash memory etc.) or anycombination thereof). The information handling system 100 can alsoinclude one or more buses 108 operable to transmit communicationsbetween the various hardware components such as any combination ofvarious input and output (I/O) devices 112.

The information handling system 100 may further include a video/graphicsdisplay device 110. The video/graphics display device 110 in anembodiment may function as a liquid crystal display (LCD), an organiclight emitting diode (OLED), a flat panel display, or a solid-statedisplay. Additionally, the information handling system 100 may includean input device 112, such as a cursor control device (e.g., touchpad, orgesture or touch screen input, a keyboard 114 and the thermo-hapticmouse 116). The thermo-haptic mouse 116 described herein may be both aninput device and an output device with the user of the thermo-hapticmouse 116 providing input to the information handling system 100 via oneor more buttons on the thermo-haptic mouse 116 and receiving output atthe thermo-haptic mouse 116 in the form of the haptics described herein.The information handling system 100 can also include a disk drive unit116.

The network interface device (NID) 120 of the information handlingsystem 100 can provide connectivity to a network 128, e.g., a wide areanetwork (WAN), a local area network (LAN), wireless local area network(WLAN), a wireless personal area network (WPAN), a wireless wide areanetwork (WWAN), or other networks. Connectivity may be via wired orwireless connection. The NID 120 may operate in accordance with anywireless data communication standards. To communicate with a wirelesslocal area network, standards including IEEE 802.11 WLAN standards, IEEE802.15 WPAN standards, WWAN such as 3GPP or 3GPP2, or similar wirelessstandards may be used. In some aspects of the present disclosure, oneNID 120 may operate two or more wireless links.

The NID 120 may connect to any combination of macro-cellular wirelessconnections including 2G, 2.5G, 3G, 4G, 5G or the like from one or moreservice providers. Utilization of radiofrequency communication bandsaccording to several example embodiments of the present disclosure mayinclude bands used with the WLAN standards and WWAN carriers, which mayoperate in both licensed and unlicensed spectrums. For example, bothWLAN and WWAN may use the Unlicensed National Information Infrastructure(U-NII) band which typically operates in the −5 MHz frequency band suchas 802.11 a/h/j/n/ac (e.g., center frequencies between 5.170-5.785 GHz).It is understood that any number of available channels may be availableunder the 5 GHz shared communication frequency band. WLAN, for example,may also operate at a 2.4 GHz band. WWAN may operate in one or morebands, some of which are proprietary but may include a wirelesscommunication frequency band at approximately 2.5 GHz band for example.In additional examples, WWAN carrier licensed bands may operate atfrequency bands of approximately 700 MHz, 800 MHz, 1900 MHz, or1700/2100 MHz for example as well. The NID 120 in an embodiment maytransceive within radio frequencies associated with the 5G New Radio(NR) Frequency Range 1 (FR1) or Frequency Range 2 (FR2). NRFR1 mayinclude radio frequencies below 6 GHz, associated with 4G LTE and otherstandards predating the 5G communications standards now emerging. NRFR2may include radio frequencies above 6 GHz, made available within the nowemerging 5G communications standard. Communications within NRFR1 may beenabled through the use of either an evolved Node B (eNodeB) executingan evolved packet core of an existing LTE system, or a Next GenerationNode B (gNodeB) executing the next generation packet core of the 5Gcellular standard.

In some embodiments, software, firmware, dedicated hardwareimplementations such as application specific integrated circuits,programmable logic arrays and other hardware devices can be constructedto implement one or more of some systems and methods described herein.Applications that may include the apparatus and systems of variousembodiments can broadly include a variety of electronic and computersystems. One or more embodiments described herein may implementfunctions using two or more specific interconnected hardware modules ordevices with related control and data signals that can be communicatedbetween and through the modules, or as portions of anapplication-specific integrated circuit. Accordingly, the present systemencompasses software, firmware, and hardware implementations.

In accordance with various embodiments of the present disclosure, themethods described herein may be implemented by firmware or softwareprograms executable by a controller or a processor system. Further, inan exemplary, non-limited embodiment, implementations can includedistributed processing, component/object distributed processing, andparallel processing. Alternatively, virtual computer system processingcan be constructed to implement one or more of the methods orfunctionalities as described herein.

The present disclosure contemplates a computer-readable medium thatincludes instructions, parameters, and profiles 124 or receives andexecutes instructions, parameters, and profiles 124 responsive to apropagated signal, so that a device connected to a network 128 cancommunicate voice, video, or data over the network 128. Further, theinstructions 124 may be transmitted or received over the network 128 viathe network interface device or NID 120.

The information handling system 100 can include a set of instructions124 that can be executed to cause the computer system to perform any oneor more of the methods or computer-based functions disclosed herein. Forexample, instructions 124 may execute a haptic mouse feedback machinelearning system 146, a peripheral device driver 148, software agents, orother aspects or components. In various embodiments herein, theinstructions 124 may execute any type of gaming applications. Varioussoftware modules comprising application instructions 124 may becoordinated by an operating system (OS), and/or via an applicationprogramming interface (API). An example operating system may includeWindows®, Android®, and other OS types. Example APIs may include Win 32,Core Java API, or Android APIs.

The disk drive unit 116 may include a computer-readable medium 122 inwhich one or more sets of instructions 124 such as software can beembedded. Similarly, main memory 104 and static memory 106 may alsocontain a computer-readable medium for storage of one or more sets ofinstructions, parameters, or profiles 124. The disk drive unit 116 andstatic memory 106 may also contain space for data storage. Further, theinstructions 124 may embody one or more of the methods or logic asdescribed herein. For example, instructions relating to the haptic mousefeedback machine learning system 146 and peripheral device driver 148software algorithms, processes, and/or methods may be stored here. In aparticular embodiment, the instructions, parameters, and profiles 124may reside completely, or at least partially, within the main memory104, the static memory 106, and/or within the disk drive 116 duringexecution by the processor 102 of information handling system 100. Asexplained, some of or all the haptic mouse feedback machine learningsystem 146 and peripheral device driver 148 may be executed locally orremotely. The main memory 104 and the processor 102 also may includecomputer-readable media.

Main memory 104 may contain computer-readable medium (not shown), suchas RAM in an example embodiment. An example of main memory 104 includesrandom access memory (RAM) such as static RAM (SRAM), dynamic RAM(DRAM), non-volatile RAM (NV-RAM), or the like, read only memory (ROM),another type of memory, or a combination thereof. Static memory 106 maycontain computer-readable medium (not shown), such as NOR or NAND flashmemory in some example embodiments. The haptic mouse feedback machinelearning system 146 and peripheral device driver 148 may be stored instatic memory 106, or the drive unit 116 on a computer-readable medium122 such as a flash memory or magnetic disk in an example embodiment.While the computer-readable medium is shown to be a single medium, theterm “computer-readable medium” includes a single medium or multiplemedia, such as a centralized or distributed database, and/or associatedcaches and servers that store one or more sets of instructions. The term“computer-readable medium” shall also include any medium that is capableof storing, encoding, or carrying a set of instructions for execution bya processor or that cause a computer system to perform any one or moreof the methods or operations disclosed herein.

In a particular non-limiting, exemplary embodiment, thecomputer-readable medium can include a solid-state memory such as amemory card or other package that houses one or more non-volatileread-only memories. Further, the computer-readable medium can be arandom-access memory or other volatile re-writable memory. Additionally,the computer-readable medium can include a magneto-optical or opticalmedium, such as a disk or tapes or other storage device to storeinformation received via carrier wave signals such as a signalcommunicated over a transmission medium. Furthermore, a computerreadable medium can store information received from distributed networkresources such as from a cloud-based environment. A digital fileattachment to an e-mail or other self-contained information archive orset of archives may be considered a distribution medium that isequivalent to a tangible storage medium. Accordingly, the disclosure isconsidered to include any one or more of a computer-readable medium or adistribution medium and other equivalents and successor media, in whichdata or instructions may be stored.

The information handling system 100 may further include a powermanagement unit (PMU) 128 (a.k.a. a power supply unit (PSU)). The PMU128 may manage the power provided to the components of the informationhandling system 100 such as the processor 102, a cooling system such asa bank of fans, one or more drive units 114, a graphical processing unit(GPU), the video/graphic display device 110, and other components thatmay require power when a power button has been actuated by a user. In anembodiment, the PMU 128 may be electrically coupled to the bus 108 toprovide this power. The PMU 128 may regulate power from a power sourcesuch as a battery 130 or A/C power adapter 132. In an embodiment, thebattery 130 may be charged via the A/C power adapter 132 and providepower the to the components of the information handling system 100 whenA/C power from the A/C power adapter 132 is removed.

As described, the information handling system 100 may also include ahaptic mouse feedback machine learning system 146 that may be operablyconnected to the bus 108. The computer readable medium 122 associatedwith the haptic mouse feedback machine learning system 146 may alsocontain space for data storage. The haptic mouse feedback machinelearning system 146 may, according to the present description, performtasks related to providing, as output, an image recognition datasetdescriptive of recognized game action event environmental data that isexperienced during execution of the gaming application. The imagerecognition dataset may be used by the processor 102 executing athermo-haptic feedback model evaluation system to provide thermo-hapticsignals to a TEG array 134-1, 134-2, 134-3 and one or more piezoelectricactuators (PEAs) 138-1, 138-2, 138-n to provide thermo-haptic feedbackcommensurate with the game action environment experienced during gameplay. This may be done in real-time as the user engages with the gamingenvironment. In the present specification and in the appended claims,the term “thermo-haptic feedback” is meant to be any changes intemperature, vibration, or both felt by a user due to the activation ofone or more of the TEG arrays 134-1, 134-2, 134-n and PEAs 138-1, 138-2,138-n.

In an embodiment, the haptic mouse feedback machine learning system 146may be trained by receiving, as training input, captured images obtainedduring the execution of a gaming application. These captured images maybe from any angle within the environment and may, in some embodiments,include an avatar. In the present specification and in the appendedclaims, the term “avatar” is meant to include any graphicalrepresentation of a user, a user's character, or a persona placed withinor interacting within the gaming environment. The captured images usedto train the haptic mouse feedback machine learning system 146 may alsoinclude representations of other environmental characteristics such asobjects, actions, or other environmental characteristics. Anon-exhaustive list of environmental characteristics may include aweapon firing, an explosion, an avatar being struck, an avatar'sinteraction with objects within the gaming environment (cold snow, warmsand, shaking ground, etc.), noises, light, among other environmentalcharacteristics. Each of these types of environmental characteristicsmay be captured in an image during, in an embodiment, a training period.The training period may be conducted during execution of the gamingapplication by the processor 102. This training period may be adedicated duration of time whether during actual gaming interactions bythe user or not. For example, during execution of the gamingapplication, the user may be directed by the gaming application toengage in a “demo” portion of the gaming environment that allows theprocessor 102 to capture the images and provide those images to thehaptic mouse feedback machine learning system 146. Alternatively, oradditionally, the images may be captured by the processor 102 duringexecution of the gaming application and during actual game play by theuser. In this embodiment, the haptic mouse feedback machine learningsystem 146 may be trained while the user engages in the interaction withthe gaming environments thereby allowing the output from the hapticmouse feedback machine learning system 146 to be more refined the longerthe player engages with that gaming environment.

In an embodiment, the haptic mouse feedback machine learning system 146may be code instructions and operate with the main memory 104, theprocessor 102, the video display 110, the alpha-numeric input device112, and the NID 120 via bus 108, and several forms of communication maybe used, including ACPI, SMBus, a 24 MHZ BFSK-coded transmissionchannel, or shared memory. Driver software, firmware, controllers, andthe like may communicate with applications on the information handlingsystem 100. During this process and after the haptic mouse feedbackmachine learning system 146 has been trained, the processor 102 mayreceive the output from the haptic mouse feedback machine learningsystem 146 that defines the image recognition dataset descriptive ofrecognized game action event environmental data during execution of thegaming application. Upon receipt of this dataset, the processor 102 mayexecute a model evaluation system. The model evaluation system may becomputer code or may be an ASIC that evaluates the accuracy of the imagerecognition dataset to determine whether the accuracy reaches athreshold. For example, the model evaluation system may determinewhether the environmental characteristics represent those environmentalcharacteristics of a game action that could be presented at thethermo-haptic mouse 116 as thermo-haptic feedback to the user. Where themodel evaluation system has determined that the output from the hapticmouse feedback machine learning system 146 has reached a thresholdaccuracy, the processor 102 causes signals to be sent to the TEG arrays134-1, 134-2, 134-n and PEAs 138-1, 138-2, 138-n to provide thisthermo-haptic feedback described herein.

In order to send the thermo-haptic signals from the processor 102, theinformation handling system 100 may implement a peripheral device driver148. The peripheral device driver 148 may include any computer code thatoperates to control the thermo-haptic mouse 116 by relaying signals fromthe processor 102 to a mouse controller 144. The mouse controller 144may execute more functions such as cursor location, click selection,scroll functions and others as understood for mouse pointing deviceoperation according to embodiments herein. The mouse controller 144 mayfurther control the relaying of the thermo-haptic signals from theprocessor 102 to each of the piezoelectric actuator (PEA) drivers 140-1,140-2, 140-n and thermoelectric generator (TEG) drivers 136-1, 136-2,136-n. Similar to the peripheral device driver 148, the TEG drivers136-1, 136-2, 136-n and PEA drivers 140-1, 140-2, 140-n may includecomputer code that, when executed by the mouse controller 144,selectively activates the respective operatively coupled TEG arrays134-1, 134-2, 134-n and PEAs 138-1, 138-2, 138-n. Each of the TEG arrays134-1, 134-2, 134-n may be operatively coupled to the mouse controller144 via a serial connector, for example, formed on a printed circuitboard (PCB) 142. The PCB 142 may, in an embodiment, be a dedicated PCB142 apart from a PCB used to mount the mouse controller 144 and whichserves as a PCB for other functions on the thermo-haptic mouse 116 suchas the button actuators, a position tracking system (e.g., trackball,optical systems, gyroscopes, etc.), scroll functions, and the like.

The TEG arrays 134-1, 134-2, 134-n may be arranged in a way to impart aheating effect or chilling effect on a surface of a housing of thethermo-haptic mouse 116. This may include those surfaces of thethermo-haptic mouse 116 that the user may touch. The TEG arrays 134-1,134-2, 134-n may, in an embodiment, may form zones across the surface ofthe thermo-haptic mouse 116 that can be individually heated or cooled.

In an embodiment, each of the TEG arrays 134-1, 134-2, 134-n may be anarray of TEGs formed on a flexible substrate. For example, a first TEGarray 134-1 may include a plurality of TEGs that each includes a p-dopedand n-doped semiconductor sandwiched between a top electric insulatorand bottom electric insulator both made of, for example, a ceramic. Eachof the of p-doped and n-doped semiconductors may be soldered between twoceramic plates and placed electrically in series and thermally inparallel to each other to form each of the TEGs. In an embodiment, theTEG arrays 134-1, 134-2, 134-3 may operate using the Peltier effect,also known as the thermoelectric effect, where application of a voltageto the p-doped and n-doped semiconductor pairs causes a change intemperature. In these embodiments, the top and bottom electricinsulators may be either heated or chilled based on an amount of voltageor polarity of voltage applied at a TEG lead operatively coupled to thearray of TEG arrays 134-1, 134-2, 134-3.

In another embodiment, a second TEG array 134-2 may also include sets ofp-doped and n-doped semiconductor sandwiched between a top electricinsulator and bottom electric insulators. These sets of p-doped andn-doped semiconductors may be operatively coupled together in series toreceive a voltage at the first TEG lead. In this embodiment, the sets ofsemiconductors, each forming a TEG, may be arranged in series and beactivated together to either heat or chill the housing of thethermo-haptic mouse 116 together depending on magnitude or voltageapplied via the first TEG lead and a second TEG lead.

In an embodiment, the second TEG array 134-2, for example, may include afirst set of TEGs coupled to a first TEG lead (forming a first array ofTEGs) with a second set of TEGs coupled to a second first TEG lead(forming a second array of TEGs). Each of the first and second sets ofTEGs may be operatively coupled to a flexible substrate such that thefirst and second sets of TEGs are placed adjacent to an interior surfaceof the housing of the thermo-haptic mouse 116. During operation, in thisembodiment, the first set of TEGs of the second TEG array 134-2 may beheated or cooled independent of whether the second set of TEGs secondTEG array 134-2 is heated or cooled. This may allow the first set ofTEGs to be heated and then cooled independently (e.g., sequentially)with the heating and cooling of the second set of TEGs. This, to theperspective of the user, feels like a heat wave has passed across theouter surface of the thermo-haptic mouse 116. As will be describedherein, this selective and sequential heating and cooling of theindividual TEG arrays may indicate environmental characteristicsoccurring, in real time, within the gaming environment. By way ofexample, the gaming application may be a first-person gaming applicationhaving a warfare genre. It is understood that these warfare genre gamesmay include explosions represented to the user on the video/graphicsdisplay device 110. Because such and explosion, in real life, would passto and over a user, this environmental characteristic may be recognizedby the processor 102 and thermo-haptic feedback model evaluation systemas a heat (and vibration) haptic feedback to be represented by at thefirst TEG array 134-1, the second TEG array 134-2, and any additionalTEG array 134-n. Because the heat wave may pass an avatar in a wavemotion, each of the TEG arrays 134-1, 134-2, 134-n may be sequentiallyactivated to impart a heat across the surface of housing of thethermo-haptic mouse 116 in a wave action. This may indicate to a user adirection and intensity of explosion that had occurred near the avataradding to the output received by the user. Similar actions may occurwhen a cold wave, such as an ice blast, pass an avatar with the TEGarrays 134-1, 134-2, 134-n being selectively activated by the mousecontroller 144 to represent a cold wave passing by the avatar. It isappreciated herein that specific use-cases are described that definespecific types of environmental characteristics that activate each ofthe TEG arrays 134-1, 134-2, 134-n in order to provide to a user actionsthat occurred within the gaming environment. Other use-cases arecontemplated herein and described herein further.

As described herein, the thermo-haptic mouse 116 may include one or morePEAs 138-1, 138-2, 138-n. The PEAs 138-1, 138-2, 138-n may be used toimpart a vibration or click against an interior surface of the housingof the thermo-haptic mouse 116 to be felt by the user. Like the TEGarrays 134-1, 134-2, 134-n, each of the PEAs 138-1, 138-2, 138-n may beoperatively coupled to a PCB 142 via a serial connector that operativelycouples the PEAs 138-1, 138-2, 138-n to the mouse controller 144 andprocessor 102 of the information handling system. Each of the PEAs138-1, 138-2, 138-n may be concurrently or sequentially activated based,again, on data signals received from the processor 102. For example, therumble or quake of an avalanche or a structure toppling may impart amoving vibration haptic feedback.

The training of the haptic mouse feedback machine learning system 146may also provide to the processor those image recognition datasetsdescriptive of recognized game action event environmental data duringexecution of the gaming application as output. The thermo-hapticfeedback model evaluation system may interpret this output as specificenvironmental characteristics that have or are occurring duringexecution of the gaming application. Signals are produced that are usedto activate the individual PEAs 138-1, 138-2, 138-n by the mousecontroller 144 to represent to the user those environmentalcharacteristics during game play. Again, it is appreciated herein thatspecific use-cases are described that define specific types ofenvironmental characteristics that activate each of the PEAs 138-1,138-2, 138-n to provide, to a user, haptic feedback based on actionsthat occurred within the gaming environment. Other use-cases arecontemplated herein and described herein further. Specific examples arepresented below in Table 1:

TABLE 1 Detected Visual Trigger Audio Trigger TEG Array Signal ConditionCondition PEA Behavior Behavior Gamer avatar Avatar gun muzzle Shortloud audio spike Single short pulse at Short temperature fires a singleimage shows large indicates gun audio a low intensity spike at low shotwith gun flash burst wave pattern intensity Gamer avatar Avatar gunpoint Repeated short loud Multiple short pulses Long temperaturecontinually image shows audio spike indicating until firing ends at aspike at low firing gun repeated large flash gun audio wave lowintensity intensity burst pattern Gamer avatar Avatar gun muzzle Shortloud audio spike Long pulse at high Long temperature being hit by imageshows blood indicating a blood intensity spike at a high gunshotsplatter splatter audio wave intensity pattern Explosion Avatar gunmuzzle Short loud audio spike Long pulse at a high Long temperaturenearby the image shows a large indicating an intensity spike at highgamer avatar flash burst explosion audio intensity pattern Enemy bulletFlash burst around Short loud audio spike Single short pulse at Shorttemperature landing (e.g., left side, right indicating a gun audio ahigh intensity spike at a high nearby gamer side, in front) gamer wavepattern intensity avatar avatar shows a medium flash burst Gamer avatarWater splash image Short loud audio spike Multiple short pulses Longcold jumps or shown indicating water splash at a low intensitytemperature steps into audio pattern until water splash change at a highwater end intensity Hitting an Enemy character Short soft audio spikeTriple short pulses at Short cold enemy image pattern shows indicating agun audio a high intensity temperature small flash burst wave patternchange at a high intensity Avatar is in a Lighting in gaming Short, softaudio No vibrations Long heat desert environment is indicating minimaltemperature bright and yellow wing blowing change at varying huedcontinuously intensities over time Avatar is in Lighting in gaming Long,loud audio No vibrations Long cool tundra environment is indicatingsever winds temperature bright and white blowing change at varying huedcontinuously intensities over time Avatar is in Lighting is varied Long,loud audio Extreme vibrations No change in an providing littleindicating sever at varying intensities temperature earthquakeindication of shaking of ground over time earthquake occurring

It is appreciated that the detected signals presented in Table 1 aboveare not meant to limit the present specification. Indeed, the presentspecification contemplates that other types of gaming application genresmay be executed by the processor 102 and the TEG arrays 134-1, 134-2,134-n and PEAs 138-1, 138-2, 138-n of the thermo-haptic mouse 116 may beactivated to reflect environmental characteristics of gaming actionevents shown in that gaming environment. These environmentalcharacteristics may include some of those environmental characteristicsof gaming action events listed above in Table 1, may include all thoseenvironmental characteristics reflected in Table 1, or may include moreenvironmental characteristics than what is reflected in Table 1. Thepresent specification contemplates that this and any example use-casepresented herein is not meant to limit the scope of the description orthe claims presented herein.

In other embodiments, dedicated hardware implementations such asapplication specific integrated circuits, programmable logic arrays andother hardware devices can be constructed to implement one or more ofthe methods described herein. Applications that may include theapparatus and systems of various embodiments can broadly include avariety of electronic and computer systems. One or more embodimentsdescribed herein may implement functions using two or more specificinterconnected hardware modules or devices with related control and datasignals that can be communicated between and through the modules, or asportions of an application-specific integrated circuit. Accordingly, thepresent system encompasses software, firmware, and hardwareimplementations.

When referred to as a “system”, a “device,” a “module,” a “controller,”or the like, the embodiments described herein can be configured ashardware. For example, a portion of an information handling systemdevice may be hardware such as, for example, an integrated circuit (suchas an Application Specific Integrated Circuit (ASIC), a FieldProgrammable Gate Array (FPGA), a structured ASIC, or a device embeddedon a larger chip), a card (such as a Peripheral Component Interface(PCI) card, a PCI-express card, a Personal Computer Memory CardInternational Association (PCMCIA) card, or other such expansion card),or a system (such as a motherboard, a system-on-a-chip (SoC), or astand-alone device). The system, device, controller, or module caninclude software, including firmware embedded at a device, such as anIntel® Core class processor, ARM® brand processors, Qualcomm® Snapdragonprocessors, or other processors and chipsets, or other such device, orsoftware capable of operating a relevant environment of the informationhandling system. The system, device, controller, or module can alsoinclude a combination of the foregoing examples of hardware or software.In an embodiment an information handling system 100 may include anintegrated circuit or a board-level product having portions thereof thatcan also be any combination of hardware and software. Devices, modules,resources, controllers, or programs that are in communication with oneanother need not be in continuous communication with each other, unlessexpressly specified otherwise. In addition, devices, modules, resources,controllers, or programs that are in communication with one another cancommunicate directly or indirectly through one or more intermediaries.

FIG. 2 is a block diagram illustrating an information handling system200 and a thermo-haptic mouse according to an embodiment of the presentdisclosure. In an embodiment, the information handling system 200 may beoperatively coupled to the thermo-haptic mouse 216 via a wired orwireless connection. In an embodiment, the thermo-haptic mouse 216 maybe operatively coupled to the information handling system 200 through astand-alone keyboard (not shown) that helps to relay signals from theprocessor of the information handling system 200 to the thermo-hapticmouse 216. In this embodiment, operatively coupling the thermo-hapticmouse 216 to the information handling system through the keyboard mayreduce the number of ports (e.g., USB ports) necessary to be installedat the information handling system.

In the embodiment where the thermo-haptic mouse 216 is operativelycoupled to the information handling system via a wireless connection,the information handling system 200 and thermo-haptic mouse 216 may eachinclude a transceiver to send and receive input and output dataaccording to the embodiments described herein. The thermo-haptic mouse216 may further include a power source such as a lithium-ion batteryused to power the components of the thermo-haptic mouse 216 duringoperation.

As described, the information handling system 200 may include avideo/graphics display device 210 to provide output to the user in theform of a visual display. Additionally, the information handling system200 may include a keyboard 214 to receive input from a user via one ormore keys. FIG. 2 depicts the information handling system 200 as alaptop-type information handling system. However, the presentspecification contemplates that the information handling system 200 maybe any type including a desktop-type information handling system with adisplay and keyboard in other embodiments.

In the context of the present specification, the video/graphics displaydevice 210 presents a gaming environment to a user. This gamingenvironment is the output resulting from the execution of a gamingapplication by the processor of the information handling system 200. Inthe embodiments described herein, the gaming environment displayscertain environmental characteristics and gaming action events. Asdiscussed herein, these environmental characteristics may includeobjects, avatars, or gaming actions presented to the user. By way ofexample, the gaming application may be a first-person shooter gamingapplication. In this example, a character avatar may not be entirelyshown on the screen but for some arms that may hold a gun, weapon, kit,or other object that the user may user to interact with other objectswithin the gaming environment. For example, the user may provide inputto the information handling system via the thermo-haptic mouse 216 tomove the avatar throughout the gaming environment, interact with anobject in the avatar's hand, shoot a gun, swing a weapon, or touchcertain other objects within the gaming environment such as snow, water,sand, and the like. Other types of gaming environments are contemplatedherein such as those where the avatar is completely viewable by theuser. The present specification contemplates that these other types ofgaming environments and any specific example presented herein is notmeant to limit the scope of the description. For ease of understanding,the examples presented herein may refer specifically to the first-persongaming environment described here.

The information handling system 200 may include a haptic mouse feedbackmachine learning system 246. The haptic mouse feedback machine learningsystem 246 may be trained prior to execution of the processor of theinformation handling system 200 in order to control the PEAs 238-1,238-2, 238-n and TEG arrays 234-1, 234-2, 234-n. During execution of thehaptic mouse feedback machine learning system 246 by the processor, animage recognition dataset descriptive of recognized game action eventenvironmental data during execution of the gaming application may bedeveloped to train the haptic mouse feedback machine learning system246. The haptic mouse feedback machine learning system 246 may build oneor more mathematical models that provides image recognition datasetsdescriptive of recognized game action event environmental data duringexecution of the gaming application. The captured images used as inputmay be accessible by the processor after the processor has executed thegaming application and recorded these images.

The haptic mouse feedback machine learning system 246 in an embodimentmay, upon execution by the processor, determine such correlations in anembodiment based on any machine learning or neural network methodologyknown in the art or developed in the future. In a specific embodiment,the haptic mouse feedback machine learning system 246 may implement anunsupervised learning or supervised learning technique. For example, thehaptic mouse feedback machine learning system 246 in an embodiment maymodel the relationships between each captured image and action withinthe gaming environment and result in relationships such as thosedescribed in Table 1. The haptic mouse feedback machine learning system246 may do this using, for example, a layered neural network topology.Such a neural network in an embodiment may include an input layerincluding a known, recorded set of image values for each of theseparameters, settings, indicators, for gaming events in images, and anoutput layer including an image recognition dataset descriptive ofrecognized game action event environmental data during execution of thegaming application, based on the known, captured images in the inputlayer. The haptic mouse feedback machine learning system 246 in anembodiment may propagate input through the layers of the neural networkto project or predict the image recognition datasets based on the knownand recorded images. Using a back-propagation method, the haptic mousefeedback machine learning system 246, in an embodiment, may then use thecaptured images to adjust weight matrices of the neural networkdescribing the ways in which image data metrics are likely to affect theimage recognition datasets for identification of gaming action events.

With the output layer, the information handling system 200 may providelearned image recognition dataset descriptive of recognized game actionevent environmental data during execution of the gaming application. Theimage recognition dataset may be used by the processor of theinformation handling system 200 executing a thermo-haptic feedback modelevaluation system 246 to provide thermo-haptic signals to an array ofTEG arrays 234-1, 234-2, 234-n and one or more PEAs 238-1, 238-2, 238-nto provide thermo-haptic feedback commensurate with the game actionevent environment during game play.

The thermo-haptic mouse 216 may include one or more TEG arrays 234-1,234-2, 234-n. Each of the TEG arrays 234-1, 234-2, 234-n may beoperatively coupled to a mouse controller 244 formed on a PCB 242. Asdescribed herein, the TEG arrays 234-1, 234-2, 234-n may each beoperatively coupled to the mouse controller 244 via a TEG driver 236-1,236-2, 236-n that allows the mouse controller 244 to send signals to theTEG arrays 234-1, 234-2, 234-n as described herein. As described herein,each of the TEG arrays 234-1, 234-2, 234-n may be activated based on thethermo-haptic signals received from the processor at the mousecontroller 244.

In an embodiment, one or more of the TEG arrays 234-1, 234-2, 234-n mayinclude an array of pairs of p-doped and n-doped semiconductors that arearranged to receive a voltage in order to heat or cool a portion of thehousing of the thermo-haptic mouse 216. In an embodiment, these pairs ofp-doped and n-doped semiconductors form a single TEG and may each beaddressed individually in an embodiment such that neighboring pairs ofp-doped and n-doped semiconductors can both heat and cool the housing sothat the user can feel changes in temperature across the outer surfaceof the housing of the thermo-haptic mouse 216. Again, the array ofp-doped and n-doped semiconductors may be soldered between two ceramicplates and placed electrically in series and thermally in parallel toeach other. In an embodiment, the TEG arrays 234-1, 234-2, 234-3 andeach TEG may operate using the Peltier effect, also known as thethermoelectric effect, where application of a voltage to the p-doped andn-doped semiconductor pairs causes a change in temperature by moving thecharge carriers within the p-doped and n-doped semiconductors. Asdescribed herein, the array of pairs of p-doped and n-dopedsemiconductors may form a single TEG or may form one or more TEG arrays234-1, 234-2, 234-n based on how the voltage is applied to any givenpair or pairs of p-doped and n-doped semiconductors.

In an embodiment, each TEG arrays 234-1, 234-2, 234-n may be operativelycoupled to a flexible substrate. The flexible substrate may allow theTEG arrays 234-1, 234-2, 234-n to be placed against an interior surfaceof the housing of the thermo-haptic mouse 216. In this embodiment, theflexible substrate allows the TEG arrays 234-1, 234-2, 234-n to conformagainst the interior surface of the housing even where the surface isnot flat.

The thermo-haptic mouse 216, in an embodiment, may also include one ormore PEAs 238-1, 238-2, 238-n operatively coupled to the mousecontroller 244. The PEAs 238-1, 238-2, 238-n may be operatively coupledto the mouse controller 244 via a PEA driver 240-1, 240-2, 240-n thatallows the mouse controller 244 to send signals to the PEAs 238-1,238-2, 238-n as described herein. In an embodiment, a PEA 238-1, 238-2,238-n may be placed below a TEG array 234-1, 234-2, 234-n such that theTEG array 234-1, 234-2, 234-n is placed between the PEA 238-1, 238-2,238-n and the interior surface of the housing of the thermo-haptic mouse216. In an embodiment, a pairing of a PEA 238-1, 238-2, 238-n and a TEGarray 234-1, 234-2, 234-n may form a thermo-haptic module that providesboth a change in temperature at a location on the thermo-haptic mouse216 as well as a vibration at that location.

As may be appreciated, the number of TEG arrays 234-1, 234-2, 234-n andPEAs 238-1, 238-2, 238-n placed within the thermo-haptic mouse 216 mayvary. In an embodiment, the number of TEG arrays 234-1, 234-2, 234-n maydefine a series of “zones” along the surface of the housing of thethermo-haptic mouse 216. Because each TEG array 234-1, 234-2, 234-n maybe addressed individually by the mouse controller 244, each zone maydefine a distinct temperature zone that may either be heated or cooledby the TEG arrays 234-1, 234-2, 234-n individually. As such, as thegaming environment changes such as when an explosion occurs near theavatar and thermo-haptic feedback is to be provided at the thermo-hapticmouse 216, the user may feel, in this example, a wave of heat passacross the surface of the housing of the thermo-haptic mouse 216. Themore zones created by the distribution of TEG arrays 234-1, 234-2, 234-nwithin the thermo-haptic mouse 216, the more granularity that wave mayfeel to the user. Similarly, the number of PEAs 238-1, 238-2, 238-n usedmay also allow for vibrations to be felt by the user in a wave motionacross the surface of the housing.

In an embodiment, the thermo-haptic mouse 216 may include over voltageprotection circuitry 248. The over voltage protection circuitry 248 mayprevent any spikes in voltage from damaging the other components of thethermo-haptic mouse 216 during operation. The over voltage protectioncircuitry 248 may include, in an embodiment, any number of fuses,resistors or other circuit that prevents any spikes in voltage fromreaching the other components of the thermo-haptic mouse 216.

The thermo-haptic mouse 216 may also include a low dropout regulator 250in an embodiment. The low dropout regulator 250 may be used to regulatean output voltage to the mouse controller 244 and other componentswithin the thermo-haptic mouse 216. The thermo-haptic mouse 216 mayregulate the voltage provided to these other components even when thevoltage supply is close in value to the output voltage.

The thermo-haptic mouse 216 may also include a motion sensor 252. Duringoperation, the user may move the thermo-haptic mouse 216 in order tomove a cursor or cause an avatar within the gaming environment to move.In an embodiment, the motion sensor 252 may include any device ordevices that detect movement of the thermo-haptic mouse 216 in order toplace the thermo-haptic mouse 216 in a “wake” state that activates anactive translation detection device. In an embodiment, the motion sensor252 is an accelerometer. In an embodiment, the motion sensor 252 mayinteract with an optical driver integrated circuit (IC) 254. The opticaldriver IC 254 may include a light emitting diode (LED) and a series ofphotodiodes. During operation, the motion sensor 252 may cause theoptical driver IC 254 to be activated such that the photodiodes detectthe light emitted from the LED. In this embodiment, the optical driverIC 254 may detect the movement of the thermo-haptic mouse 216 relativeto the underlying surface. Although the present specification describesan optical driver IC 254 used to detect the movement of thethermo-haptic mouse 216, the present specification contemplates thatother devices may be used such as a ball and roller system, a rollersystem, a LED detection system, and a gyroscopic system.

In an embodiment, input from the motion sensor 252 and optical driver IC254 may be received at the mouse controller 244 along with other inputsfrom one or more buttons 258 formed at the thermo-haptic mouse 216.These buttons 258 may be used by a user to make selections on agraphical user interface (GUI) at the video/graphics display device 210.In specific embodiments, the buttons 258 may include a left-clickbutton, a right-click button, and any other side buttons placed at athumb location on the thermo-haptic mouse 216. In an embodiment, thethermo-haptic mouse 216 may also include a roller wheel to, in anembodiment, allow the user to scroll up and down a GUI.

The mouse controller 244 may be operatively coupled to an EEPROM 260that may be used to, at least temporarily, store data such as signaldata to be used by the mouse controller 244. The mouse controller 244may access this EEPROM 260 in order to selectively activate the PEAs238-1, 238-2, 238-n and TEG arrays 234-1, 234-2, 234-n. A clock 256 mayalso be used to synchronize the application of the feedback signalsreceived by the mouse controller 244 from the processor of theinformation handling system 200.

FIG. 3 is a side, partial cut-away view of a thermo-haptic mouse 316according to an embodiment of the present disclosure. FIG. 3 shows onlya portion of the housing 370, 372 of the thermo-haptic mouse 316 beingremoved to show the interior portions of the thermo-haptic mouse 316.The removed portions of the housing 370, 372 shown in FIG. 3 may includea portion of a mouse bottom and side housing 372 or a portion of a palmrest housing 370. Additionally, FIG. 3 include window “A” used tohighlight a portion of the thermo-haptic mouse 316 represented in FIG.4.

The thermo-haptic mouse 316 may be operatively coupled to an informationhandling system (not shown) by either a wired or wireless connection.Where the thermo-haptic mouse 316 is operatively coupled to aninformation handling system via a wired connection, the thermo-hapticmouse 316 may include a signal and power line operatively coupled to aroller/LED PCB 364. The wired connection to the roller/LED PCB 364 mayprovide the signal data from the processor of the information handlingsystem as well as a voltage from, for example, a PMU at the informationhandling system. Where the thermo-haptic mouse 316 is operativelycoupled to the information handling system via a wireless connection,the roller/LED PCB 364 may include a transceiver used to transmit andreceive data to and from the information handling system. In thisembodiment, the thermo-haptic mouse 316 may further include astand-alone power source such as a battery (e.g., lithium ionrechargeable battery).

In the embodiment shown in FIG. 3, the thermo-haptic mouse 316 mayinclude a first PCB such as the roller/LED PCB 364 and a second PCB suchas PCB 342. The roller/LED PCB 364 may include circuitry used to receiveinput from one or more buttons 358 and a scrolling wheel 368 used by theuser to provide input to the information handling system. Additionalbuttons may also be arranged for convenience to the user along thesurface of the thermo-haptic mouse 316 such as one or more side buttons(not shown). Although FIG. 3 does not show a side button due to theportion of the housing 370, 372 being removed, FIG. 3 does show two sidebutton actuators 366 that interface with the physical buttons placed onthe side or thumb portion of the thermo-haptic mouse 316 (e.g., wherethe thermo-haptic mouse 316 is a right-handed mouse). Additional buttonactuators 366 are also present with each of the other buttons 358 butare not shown in FIG. 3 due to the housing 370, 372 of the thermo-hapticmouse 316 obstructing the view.

The roller/LED PCB 364 of the thermo-haptic mouse 316 may also includecircuitry associated with a position- and movement-detection system. Asdescribed in connection with FIG. 2, the thermo-haptic mouse 316 mayinclude a motion sensor that detects when the thermo-haptic mouse 316 isbumped or moved. This motion sensor may be used to “wake” the mouse sothat power may be initiated at, for example, and optical driver alsoplaced on the main roller/LED PCB 364. This may converse energy as wellas reduce wear and tear on the components of the thermo-haptic mouse 316when the thermo-haptic mouse 316 is not being used by still activated.The circuitry for both the motion sensor and optical driver (or othertype of acceleration and position sensor such as a roller) may be placedon the roller/LED PCB 364.

The roller/LED PCB 364 may, in an embodiment, also house the mousecontroller described herein and in connection with FIGS. 1 and 2 that isused to receive this input from the actuation of the buttons 358, theircorresponding button actuators 366, scrolling wheel 368, the motionsensor, and the optical driver. This data received by the mousecontroller may be processed into input data used by the informationhandling system to interact with a graphical user interface at theinformation handling system. In the context of the presentspecification, the input data provided by the mouse controller may beused to control an action within a gaming environment during executionof a gaming application. By way of example, the input data from themouse controller to the processor of the information handling system maybe interpreted by the processor to control a cursor on thevideo/graphics display device, control movement of an avatar within agaming environment, or otherwise initiate a gaming action during gameplay.

The thermo-haptic mouse 316 may also include a dedicated PCB 342 that isoperatively coupled to the roller/LED PCB 364 and the mouse controllerin an embodiment. The dedicated PCB 342 may include circuitry associatedwith any TEG driver and PEA driver as well as connection ports used tooperatively couple the first TEG array 334-1, the second TEG array334-2, the first PEA 338-1, and the second PEA 338-2 in the embodimentin FIG. 3. Although FIG. 3 as well as the other figures herein, show theroller/LED PCB 364 and dedicated PCB 342 are two separate PCBs, thepresent specification contemplates that these two PCBs may be combinedto reduce a footprint within the thermo-haptic mouse 316. In anembodiment, either of the roller/LED PCB 364 and dedicated PCB 342 maybe divided into a further number of PCBs in order to better arrange ofcircuitry within the thermo-haptic mouse 316.

FIG. 3 also shows a specific arrangement of the first TEG array 334-1,second TEG array 334-2, first PEA 338-1, and second PEA 338-2 relativeto each other. Although FIG. 3 shows only two TEG arrays and two PEAs,the present specification contemplates that any number of TEG arrays andPEAs may be placed within the housing of the thermo-haptic mouse 316 andagainst an inner surface of the housing 370, 372 of the thermo-hapticmouse 316. The location of the TEG arrays and PEAs may also vary. In anembodiment, one or more TEG arrays and/or PEAs may be placed underneatha button 358, along a side of the thermo-haptic mouse 316, or at anyother location where a user may touch, even temporarily, thethermo-haptic mouse 316.

As described herein either of the first TEG array 334-1 and second TEGarray 334-2 may include an array of p-doped and n-doped semiconductorpairs. The first TEG array 334-1 and second TEG array 334-2 shown inFIG. 3 may each be addressed by the mouse controller individually sothat each of the first TEG array 334-1 and second TEG array 334-2 may beactivated individually.

The p-doped and n-doped semiconductor pairs may be sandwiched between atop electric insulator and bottom electric insulator both made of, forexample, a ceramic. The second TEG array 334-2 in FIG. 3 as well as theother figures are shown to not include these ceramic insulators for easeof illustration. However, it is intended that second TEG array 334-2 orany other TEG array placed within the thermo-haptic mouse 316 includesthose ceramic electric insulators as that shown in the first TEG array334-1 of FIG. 3.

The p-doped and n-doped semiconductor pairs, in the presentspecification, may each be considered a TEG in its own and each of thefirst TEG array 334-1 and second TEG array 334-2 may be referred hereinas an array of TEG arrays. In an embodiment, each of the p-doped andn-doped semiconductor pairs as a single TEG may be addressedindividually so that each of the TEGs may provide specific hapticfeedback to the user in some embodiments. In a specific example,neighboring TEG arrays may be concurrently, sequentially, or otherwiseactivated to either heat or cool the housing 370, 372 of thethermo-haptic mouse 316. This selective activation of each of the TEGarrays may, to the perspective of the user, feel like a heat wave orcold wave has passed across the outer surface of the thermo-haptic mouse316. In an embodiment, multiple TEG arrays may be used to definespecific zones on the thermo-haptic mouse 316 and may be activated bythe mouse controller in order to provide that haptic feedback. Again,the detected signals by the processor of the information handling systemsuch as those shown in Table 1 may be used to provide specific TEG arraybehavior and this embodiment incorporates the use of those types ofdetected signals among others.

In an embodiment, the first TEG array 334-1 or second TEG array 334-2may include a plurality of p-doped and n-doped semiconductor pairs thatare activated together to heat or cool the housing 370, 372 of thethermo-haptic mouse 316. In an embodiment, the first TEG array 334-1 andsecond TEG array 334-2 may be independently activated at different timesto provide a specific haptic feedback to the user. In an embodiment, inorder to increase the number of zones that may independently heated orcooled, the number of TEG arrays 334-1, 334-2 placed across an interiorsurface of the housing 370, 372 may be increased. In this embodiment,the number of connectors to and from the TEG arrays 334-1, 334-2 mayincrease as the number of TEG arrays 334-1, 334-2 increases and thededicated PCB 342 may incorporate these other connectors. In anembodiment, each of the TEG arrays 334-1, 334-2 may include a first leadoperatively coupling the TEG arrays 334-1, 334-2 to the dedicated PCB342 via a first connector. Additionally, in this embodiment, each of theTEG arrays 334-1, 334-2 may include a second lead operatively couplingthe TEG arrays 334-1, 334-2 via another connector. The connectors inthese embodiments may be operatively coupled to a TEG driver and themouse controller as described herein. In these embodiments, the firstlead and second lead may be used to provide a specific amount of voltageat a specific polarity across the TEGs within the TEG array in order tocause one of a heated or cooled effect at the first TEG array 334-1 andsecond TEG array 334-2.

As shown in FIG. 3, the thermo-haptic mouse 316 also includes a firstPEA 338-1 and a second PEA 338-2. Again, the number of PEAs placedwithin the housing of the thermo-haptic mouse 316 may be more or lessthan two and the present specification contemplates these additionalembodiments. Much like the TEG arrays 334-1, 334-2, the PEAs 338-1,338-2 may be arranged so that they may impart a vibration click, orother mechanical effect on the housing 370, 372 of the thermo-hapticmouse 316 in order to provide another different kind of haptic feedbackto the user. Again, the detected signals by the processor of theinformation handling system such as those shown in Table 1 may be usedto provide specific PEA behavior and this embodiment incorporates theuse of those types of detected signals among others in order to providespecific haptic feedback to the user.

In the embodiment shown in FIG. 3, a first PEA 338-1 has been placedbehind the first TEG array 334-1 such that the first TEG array 334-1 issandwiched between the first PEA 338-1 and an interior surface of thehousing 370, 372 of the thermo-haptic mouse 316. In this arrangement thefirst PEA 338-1 can impart a vibration against the first TEG array 334-1and the housing 370, 372 when activated. Activation of the first PEA338-1 (and second PEA 338-2) may be accomplished when the mousecontroller receives signals to activate the first PEA 338-1 and sends avoltage to piezoelectric material layer causing the piezoelectricmaterial to expand. When the voltage is removed, the piezoelectricmaterial shrinks back to its rest state. This expansion and contractionof the piezoelectric material upon selective application of the voltagecreates a vibration click, or other mechanical effect that is felt by auser at a location on the surface of the housing 370, 372.

In an embodiment, a first PEA 338-1 and first TEG array 334-1 pair maybe described herein as a thermo-haptic module. Multiple thermo-hapticmodules (e.g., second TEG array 334-2 with a second PEA 338-2) may bearranged anywhere within the housing 370, 372 and along an interior wallof the housing 370, 372. Again, in order to increase the granularity ofhaptic feedback felt by the user, the number of thermo-haptic modulesmay be increased creating more zones along the surface of the housing370, 372.

In an embodiment, the thermo-haptic module including a TEG array 334-1,334-2 and a PEA 338-1, 338-2 may be arranged along an interior surfaceof the palm rest housing 370 where a user's palm is meant to rest. Thismay be one of many locations where these thermo-haptic modules may beplaced and includes sufficient surface area to create multiplethermo-haptic feedback zones that can be detected by the user duringoperation of the thermo-haptic mouse 316. Additional locations may alsoinclude a button location and side locations where the thermo-hapticmodules may be placed to impart the thermo-haptic feedback to a user.

FIG. 4 is a side, partial cut-away view of a thermo-haptic mouse 416according to an embodiment of the present disclosure. FIG. 4specifically shows the window “A” in FIG. 3 in a closer view in order toview the details of the interface between the dedicated PCB 442 and theTEG arrays 434-1, 434-2 and PEAs 438-1, 438-2. Again, FIG. 4 shows apartial cut-away of the housings 470, 472 of the thermo-haptic mouse 416in order to show the interior of the thermo-haptic mouse 416. The secondTEG array 434-2 in FIG. 4 as well as the other figures are shown to notinclude these ceramic insulators for ease of illustration. However, itis intended that second TEG array 434-2 or any other TEG array placedwithin the thermo-haptic mouse 416 includes those ceramic electricinsulators as that shown in the first TEG array 434-1 of FIG. 4.

The thermo-haptic mouse 416 includes a PCB 442 that has circuitry formedthereon to interface with the TEG arrays 434-1, 434-2 and PEAs 438-1,438-2. In an embodiment, a first TEG array 434-1 may be operativelycoupled to a first TEG controller/connector 478-1 via a first TEG firstlead 474-1. The first TEG controller/connector 478-1 may include, forexample, an application specific integrated circuit (ASIC) used toexecute a TEG driver as described herein. In a specific embodiment, thefirst TEG controller/connector 478-1 (along with any othercontroller/connector described herein) may receive input from the mousecontroller and may server as a processing or information handling systemused to execute, for example, a driver application and cause the TEGarray or PEA to be activated. In this embodiment, the first TEGcontroller/connector 478-1 may include an electrical connection such asa serial port to operatively couple the first TEG first lead 474-1between the first TEG controller/connector 478-1 and first TEG array434-1. In an embodiment, the first TEG controller/connector 478-1 mayalso include a second serial connection to operatively couple a firstTEG second lead (not shown) between the first TEG controller/connector478-1 and first TEG array 434-1. In an alternative embodiment, the TEGarray 434-1 may include a single wire with a voltage applied to ground.In either example, a voltage is applied to the TEGs (e.g., the p-dopedand n-doped semiconductor pairs 482, 483) in order to either heat orcool a top insulative layer (e.g., ceramic layer).

In an embodiment, a second TEG array 434-2 may be operatively coupled toa second TEG controller/connector 478-2 via a second TEG first lead474-2. The second TEG controller/connector 478-2 may include, forexample, an application specific integrated circuit (ASIC) used toexecute a TEG driver as described herein. The second TEGcontroller/connector 478-2 may include an electrical connection such asa serial port to operatively couple the second TEG first lead 474-2between the first TEG controller/connector 478-1 and second TEG array434-2. In an embodiment, the second TEG controller/connector 478-2 mayalso include a second serial connection to operatively couple a secondTEG second lead (not shown) between the second TEG controller/connector478-2 and second TEG array 434-2.

In an embodiment, a first PEA 438-1 may be operatively coupled to afirst PEA controller/connector 480-1 via a first PEA first lead 476-1.The first PEA controller/connector 480-1 may include, for example, anapplication specific integrated circuit (ASIC) used to execute a PEAdriver as described herein. The first PEA controller/connector 480-1 mayinclude an electrical connection such as a serial port to operativelycouple the first PEA first lead 476-1 between the first PEAcontroller/connector 480-1 and first PEA 438-1. In an embodiment, thefirst PEA controller/connector 480-1 may also include a second serialconnection to operatively couple a first PEA second lead (not shown)between the first PEA controller/connector 480-1 and first PEA 438-1.

In an embodiment, a second PEA 438-2 may be operatively coupled to asecond PEA controller/connector 480-2 via a second PEA first lead 476-2.The second PEA controller/connector 480-2 may include, for example, anapplication specific integrated circuit (ASIC) used to execute a PEAdriver as described herein. The second PEA controller/connector 480-2may include an electrical connection such as a serial port tooperatively couple the second PEA first lead 476-2 between the secondPEA controller/connector 480-2 and second PEA 438-2. In an embodiment,the second PEA controller/connector 480-2 may also include a secondserial connection to operatively couple a second PEA second lead (notshown) between the second PEA controller/connector 480-2 and second PEA438-2.

Again, in an embodiment, a first PEA 438-1 and first TEG array 434-1pair may be described herein as a thermo-haptic module. Multiplethermo-haptic modules (e.g., second TEG array 434-2 with a second PEA438-2) may be arranged anywhere within the housing 470, 472 and along aninterior wall of the housing 470, 472. Again, in order to increase thegranularity of haptic feedback felt by the user, the number ofthermo-haptic modules may be increased creating more zones along thesurface of the housing 470, 472 in some embodiments.

In an embodiment, the thermo-haptic module including a TEG array 434-1,434-2 and a PEA 438-1, 438-2 may be arranged along an interior surfaceof the palm rest housing 470 where a user's palm is meant to rest. Thismay be one of many locations where these thermo-haptic modules may beplaced and includes sufficient surface area to create multiplethermo-haptic feedback zones that can be detected by the user duringoperation of the thermo-haptic mouse 416. Additional locations may alsoinclude a button location and side locations where the thermo-hapticmodules may be placed to impart the thermo-haptic feedback to a user invarious embodiments.

As described herein either of the first TEG array 434-1 and second TEGarray 434-2 may include an array of p-doped and n-doped semiconductorpairs 482, 483. The p-doped and n-doped semiconductor pairs 482, 483 maybe sandwiched between a top electric insulator and bottom electricinsulator both made of, for example, a ceramic. The p-doped and n-dopedsemiconductor pairs 482, 483 in the present specification of the TEGarrays 434-1 and 434-2, may each be considered a single TEG in its ownand each of the first TEG array 434-1 and second TEG array 434-2 may bereferred herein as an array of TEGs 482, 483. In an embodiment, each ofthe TEGs 482, 483 may be addressed individually so that each of the TEGs482, 483 may individually provide haptic feedback to the user in someembodiments. Additionally, or alternatively, the entire TEG arrays 434-1and 434-2 may be addressed, in other embodiments. In a specific example,neighboring TEGs 482, 483 may be activated to either heat or cool thehousing 470, 472 of the thermo-haptic mouse 416. This selectiveactivation of each of the TEGs 482, 483 within the TEG array 434-1 and434-2 may, to the perspective of the user, feel like a heat wave or coldwave has passed across the outer surface of the thermo-haptic mouse 416.Again, the detected signals by the processor of the information handlingsystem such as those shown in Table 1 may be used to provide specificTEG array 434-1 and 434-2 behavior and this embodiment incorporates theuse of those types of detected signals among others. As the number ofindividual TEGs 482, 483 is increased, a plural number of TEG firstleads 474-1, 474-2 may be used to address the array of TEGs 482, 483created. These leads may be formed into a serial lead line that allowseach TEG 482 or 483 to operate as a single TEG or group of TEGs 482 or483 to be addressed individually. In a specific embodiment, theplurality of serial leads may be arranged on a flexible substrate 488 tooperatively couple the TEGs 482, 483 to the TEG drivers and connectorsas described herein. In these embodiments, as the gaming environmentchanges when, for example, an explosion occurs near the avatar andthermo-haptic feedback is to be provided at the thermo-haptic mouse, theuser may feel, in this example, a wave of heat pass across the surfaceof the housing of the thermo-haptic mouse. The more zones created by thedistribution of TEGs within the thermo-haptic mouse, the moregranularity that wave may feel to the user.

FIG. 5 is a perspective, cut-away view of a thermo-haptic mouse 516according to an embodiment of the present disclosure. Again, FIG. 5shows a partial cut-away of the housings 570, 572 of the thermo-hapticmouse 516 in order to show the interior of the thermo-haptic mouse 516.The second TEG array 534-2 in FIG. 5 as well as the other figures areshown to not include these ceramic insulators for ease of illustration.However, it is intended that second TEG array 534-2 or any other TEGarray placed within the thermo-haptic mouse 516 includes those ceramicelectric insulators as that shown in the first TEG array 534-1 of FIG.5.

The thermo-haptic mouse 516 includes a PCB 542 that has circuitry formedthereon to interface with the TEG arrays 534-1, 534-2 and PEAs 538-1,538-2. The circuitry may include interfaces with one or more buttonactuators 566 that receive input from a user pressing a button (notshown) formed on the housing 572 of the thermo-haptic mouse 516. Thecircuitry may also include, in an embodiment, a first TEG array 534-1may be operatively coupled to a first TEG controller/connector 578-1 viaa first TEG first lead 574-1. The first TEG controller/connector 578-1may include, for example, an application specific integrated circuit(ASIC) used to execute a TEG driver as described herein. The first TEGcontroller/connector 578-1 may include an electrical connection such asa serial port to operatively couple the first TEG first lead 574-1between the first TEG controller/connector 578-1 and first TEG array534-1. In an embodiment, the first TEG controller/connector 578-1 mayalso include a second serial connection to operatively couple a firstTEG second lead 584-1 between the first TEG controller/connector 578-1and first TEG array 534-1.

In an embodiment, a second TEG array 534-2 may be operatively coupled toa second TEG controller/connector 578-2 via a second TEG first lead574-2. The second TEG controller/connector 578-2 may include, forexample, an application specific integrated circuit (ASIC) used toexecute a TEG driver as described herein. The second TEGcontroller/connector 578-2 may include an electrical connection such asa serial port to operatively couple the second TEG first lead 574-2between the first TEG controller/connector 578-1 and second TEG array534-2. In an embodiment, the second TEG controller/connector 578-2 mayalso include a second serial connection to operatively couple a secondTEG second lead 584-2 between the second TEG controller/connector 578-2and second TEG array 534-2. In these embodiments, the first lead andsecond lead may be used to provide a specific amount of voltage at aspecific polarity across the plurality of TEGs 582, 583 in order tocause one of a heated or cooled effect at the first TEG array 534-1 andsecond TEG array 534-2.

In an embodiment, a first PEA 538-1 may be operatively coupled to afirst PEA controller/connector 580-1 via a first PEA first lead 576-1.The first PEA controller/connector 580-1 may include, for example, anapplication specific integrated circuit (ASIC) used to execute a PEAdriver as described herein. The first PEA controller/connector 580-1 mayinclude an electrical connection such as a serial port to operativelycouple the first PEA first lead 576-1 between the first PEAcontroller/connector 580-1 and first PEA 538-1. In an embodiment, thefirst PEA controller/connector 580-1 may also include a second serialconnection to operatively couple a first PEA second lead 586-1 betweenthe first PEA controller/connector 580-1 and first PEA 538-1.

In an embodiment, a second PEA 538-2 may be operatively coupled to asecond PEA controller/connector 580-2 via a second PEA first lead 576-2.The second PEA controller/connector 580-2 may include, for example, anapplication specific integrated circuit (ASIC) used to execute a PEAdriver as described herein. The second PEA controller/connector 580-2may include an electrical connection such as a serial port tooperatively couple the second PEA first lead 576-2 between the secondPEA controller/connector 580-2 and second PEA 538-2. In an embodiment,the second PEA controller/connector 580-2 may also include a secondserial connection to operatively couple a second PEA second lead (notshown) between the second PEA controller/connector 580-2 and second PEA538-2.

Again, in an embodiment, a first PEA 538-1 and first TEG array 534-1pair may be described herein as a thermo-haptic module. Multiplethermo-haptic modules (e.g., second TEG array 534-2 with a second PEA538-2) may be arranged anywhere within the housing 570, 572 and along aninterior wall of the housing 570, 572. Again, in order to increase thegranularity of haptic feedback felt by the user, the number ofthermo-haptic modules may be increased creating more zones along thesurface of the housing 570, 572.

In an embodiment, the thermo-haptic module including a TEG array 534-1,534-2 and a PEA 538-1, 338-2 may be arranged along an interior surfaceof the palm rest housing 570 where a user's palm is meant to rest. Thismay be one of many locations where these modules may be placed andincludes sufficient surface area to create multiple thermo-hapticfeedback zones that can be detected by the user during operation of thethermo-haptic mouse 516. Additional locations may also include a buttonlocation and side locations where the thermo-haptic modules may beplaced to impart the thermo-haptic feedback to a user.

As described herein either of the first TEG array 534-1 and second TEGarray 534-2 may include an array of p-doped and n-doped semiconductorpairs 582 or 583 respectively. The p-doped and n-doped semiconductorpairs 582 or 583 may be sandwiched between a top electric insulator andbottom electric insulator both made of, for example, a ceramic. Thep-doped and n-doped semiconductor pairs 582 or 583, in the presentspecification, may each be considered a single TEG 582, 583 in its ownand each of the first TEG array 534-1 and second TEG array 534-2 may bereferred herein as an array of TEGs 582 or 583, respectively. In anembodiment, each of the p-doped and n-doped semiconductor pairs 582 or583 as a single TEG may be addressed individually so that each of theTEGs 582 or 583 may concurrently provide haptic feedback to the user. Ina specific example, neighboring TEGs 582 or 583 may be activated toeither heat or cool the housing 570, 572 of the thermo-haptic mouse 516.This selective activation of each of the TEGs 582 or 583 within the TEGarray 534-1 and 534-2 may, to the perspective of the user, feel like aheat wave or cold wave has passed across the outer surface of thethermo-haptic mouse 516. Also, TEG arrays 534-1 and 534-2 may beselectively activated to define specific zones on the thermo-hapticmouse 316 and may be activated by the mouse controller in order toprovide that haptic feedback. Again, the detected signals by theprocessor of the information handling system such as those shown inTable 1 may be used to provide specific TEG array 534-1 and 534-2behavior and this embodiment incorporates the use of those types ofdetected signals among others. As the number of individual TEGs 582, 583is increased, the number of TEG first leads 574-1, 574-2 may be used toaddress the TEGs arrays 534-1 and 534-2 created. These leads may beformed into a serial lead line that allows each p-doped and n-dopedsemiconductor pairs 582 or 583 as a single TEG or group of p-doped andn-doped semiconductor pairs 582 or 583 to be addressed individually. Ina specific embodiment, the plurality of serial leads may be arranged ona flexible substrate 588 to operatively couple the TEGs 582, 583 to theTEG drivers and connectors as described herein.

FIG. 6 is a perspective, cut-away view of a thermo-haptic mouse 616according to an embodiment of the present disclosure. FIG. 6 shows apartial cutout of the housings 670, 672 of the thermo-haptic mouse 616in order to show the interior of the thermo-haptic mouse 616. In thisview shown in FIG. 6 a portion of the palm rest housing 670 has beenremoved to show a top view of the first TEG array 634-1 and second TEGarray 634-2. Any PEAs have been blocked from view at this angle but afirst PEA first lead 676-1 and a second PEA first lead 676-2 are shownin FIG. 6. The second TEG array 634-2 in FIG. 6 as well as the otherfigures are shown to not include these ceramic insulators for ease ofillustration. However, it is intended that second TEG array 634-2 or anyother TEG array placed within the thermo-haptic mouse 616 includes thoseceramic electric insulators as that shown in the first TEG array 634-1of FIG. 6.

The thermo-haptic mouse 616 includes a dedicated PCB 642 that hascircuitry formed thereon to interface with the TEG arrays 634-1, 634-2and PEAs 638-1, 638-2. The circuitry may include interfaces with one ormore button actuators (not shown) that receive input from a userpressing a button (not shown) formed on the housing 672 of thethermo-haptic mouse 616. The circuitry may also include, in anembodiment, a first TEG array 634-1 may be operatively coupled to afirst TEG controller/connector 678-1 via a first TEG first lead 674-1.The first TEG controller/connector 678-1 may include, for example, anapplication specific integrated circuit (ASIC) used to execute a TEGdriver as described herein. The first TEG controller/connector 678-1 mayinclude an electrical connection such as a serial port to operativelycouple the first TEG first lead 674-1 between the first TEGcontroller/connector 678-1 and first TEG array 634-1. In an embodiment,the first TEG controller/connector 678-1 may also include a secondserial connection to operatively couple a first TEG second lead (notshown) between the first TEG controller/connector 678-1 and first TEGarray 634-1. During operation, the first TEG controller/connector 678-1may operatively communicate with the mouse controller formed on aroller/light-emitting diode (LED) PCB similar to the roller/LED PCBdescribed in connection with FIG. 3. The dedicated PCB 642 may,therefore, be operatively coupled to the roller/LED PCB using adedicated connection so that data signals from the mouse controllerdescribing how and when to activate any of the first TEG array 634-1,second TEG array 634-2, or any PEA may be received by their respectivecontrollers 678-1, 678-2, 680-1, 680-2.

FIG. 6, similar to other figures herein, show that the first TEGcontroller/connector 678-1, second TEG controller/connector 678-2, firstPEA controller/connector 680-1, and second PEA controller/connector680-2 may include or be part of a connector formed on the PCB 642.However, the present specification contemplates that any controller usedto operate the TEG arrays and PEAs may be formed separately from anyconnector. In an embodiment, the individual controllers 678-1, 678-2,680-1, 680-2 may be formed on the roller/LED PCB and be operativelycoupled to a connector on the dedicated PCB 642.

In an embodiment, a second TEG array 634-2 may be operatively coupled toa second TEG controller/connector 678-2 via a second TEG first lead674-2. The second TEG controller/connector 678-2 may include, forexample, an application specific integrated circuit (ASIC) used toexecute a TEG driver as described herein. The second TEGcontroller/connector 678-2 may include an electrical connection such asa serial port to operatively couple the second TEG first lead 674-2between the first TEG controller/connector 678-1 and second TEG array634-2. In an embodiment, the second TEG controller/connector 678-2 mayalso include a second serial connection to operatively couple a secondTEG second lead (not shown) between the second TEG controller/connector678-2 and second TEG array 634-2.

In an embodiment, a first PEA (not shown) may be operatively coupled toa first PEA controller/connector 680-1 via a first PEA first lead 676-1.The first PEA controller/connector 680-1 may include, for example, anapplication specific integrated circuit (ASIC) used to execute a PEAdriver as described herein. The first PEA controller/connector 680-1 mayinclude an electrical connection such as a serial port to operativelycouple the first PEA first lead 676-1 between the first PEAcontroller/connector 680-1 and first PEA 638-1. In an embodiment, thefirst PEA controller/connector 680-1 may also include a second serialconnection to operatively couple a first PEA second lead (not shown)between the first PEA controller/connector 680-1 and first PEA 638-1.

In an embodiment, a second PEA 638-2 may be operatively coupled to asecond PEA controller/connector 680-2 via a second PEA first lead 676-2.The second PEA controller/connector 680-2 may include, for example, anapplication specific integrated circuit (ASIC) used to execute a PEAdriver as described herein. The second PEA controller/connector 680-2may include an electrical connection such as a serial port tooperatively couple the second PEA first lead 676-2 between the secondPEA controller/connector 680-2 and second PEA 638-2. In an embodiment,the second PEA controller/connector 680-2 may also include a secondserial connection to operatively couple a second PEA second lead (notshown) between the second PEA controller/connector 680-2 and second PEA638-2.

Again, in an embodiment, a first PEA 638-1 and first TEG array 634-1pair may be described herein as a thermo-haptic module. Multiplethermo-haptic modules (e.g., second TEG array 634-2 with a second PEA638-2) may be arranged anywhere within the housing 670, 672 and along aninterior wall of the housing 670, 672. Again, in order to increase thegranularity of haptic feedback felt by the user, the number ofthermo-haptic modules may be increased creating more zones along thesurface of the housing 670, 672.

In an embodiment, the thermo-haptic module including a TEG array 634-1,634-2 and a PEA 638-1, 338-2 may be arranged along an interior surfaceof the palm rest housing 670 where a user's palm is meant to rest. Thismay be one of many locations where these thermo-haptic modules may beplaced and includes sufficient surface area to create multiplethermo-haptic feedback zones that can be detected by the user duringoperation of the thermo-haptic mouse 616. Additional locations may alsoinclude a button location and side locations where the thermo-hapticmodules may be placed to impart the thermo-haptic feedback to a user.

As described herein either of the first TEG array 634-1 and second TEGarray 634-2 may include an array of p-doped and n-doped semiconductorpairs 682 or 683. The p-doped and n-doped semiconductor pairs 682 or 683may be sandwiched between a top electric insulator and bottom electricinsulator both made of, for example, a ceramic. The p-doped and n-dopedsemiconductor pairs 682 or 683, in the present specification, may eachbe considered a single operating TEG in its own and each of the firstTEG array 634-1 and second TEG array 634-2 may be referred herein as anarray of TEGs 682 or 683. In an embodiment, each of the p-doped andn-doped semiconductor pairs 682 or 683 as a single TEG may be addressedindividually so that each of the TEGs 682 or 683 may concurrentlyprovide haptic feedback to the user. In a specific example, neighboringTEGs 682 and 683 may be concurrently activated to either heat or coolthe housing 670, 672 of the thermo-haptic mouse 616. This selectiveactivation of each of the TEGs 682 or 683 within the TEG array may, tothe perspective of the user, feel like a heat wave or cold wave haspassed across the outer surface of the thermo-haptic mouse 616. Again,the detected signals by the processor of the information handling systemsuch as those shown in Table 1 may be used to provide specific TEG 682or 683 behavior or groups of TEGs 682 or 683 within TEG arrays 634-1 and634-2 and this embodiment incorporates the use of those types ofdetected signals among others. As the number of individual p-doped andn-doped semiconductor pairs 682 as a single TEG 682 or 683 is increased,the number of TEG first leads 674-1, 674-2 may be used to address theindividual TEG stacks 682 or 683, groups of TEG stacks 682 or 683, orTEG arrays 634-1 and 634-2 created. These leads may be formed into aserial lead line that allows each p-doped and n-doped semiconductor pair682 or 683 as a single TEG or group of p-doped and n-doped semiconductorpairs 682 or 683 to be addressed individually. In a specific embodiment,the plurality of serial leads may be arranged on a flexible substrate688 to operatively couple the TEG arrays 634-1 and 634-2 to the TEGdrivers and connectors as described herein. In other embodiments, eachTEG array 634-1, 634-2 may be addressed as a group of TEGs 682 or 683 aswell as described herein.

FIG. 7 is a perspective view of a TEG array 734 according to anembodiment of the present disclosure. The TEG array 734 may include aplurality of p-doped 790 and n-doped semiconductor 792 pairs 782 with atop electric insulator layer 794 formed between the p-doped and n-dopedsemiconductor pairs 782. In an embodiment, the p-doped 790 and n-dopedsemiconductor 792 pairs 782 may be connected in series using a flexiblesubstrate 788 as a surface to operatively coupled the p-doped 790 andn-doped semiconductor 792 pairs 782 using electrical traces formedthereon. In this embodiment, the TEG array 734 may receive a voltageacross a TEG first lead 774 to a TEG second lead 784 in order toselectively heat and cool a portion of the housing with the TEG array734 of the thermo-haptic mouse described herein.

In an alternative embodiment, the TEG array 734 shown in FIG. 7 mayinclude multiple addressable TEGs 782 formed out of each of the p-doped790 and n-doped semiconductor 792 pairs 682. In this embodiment, the TEGfirst lead 774 and TEG second lead 784 may include a plurality of wiresthat address a single or a group of p-doped and n-doped semiconductorpairs 782, individually, such that the TEG array 734 shown here becomesan array of individually activatable TEG pairs 782. The p-dopedsemiconductor 790 and n-doped semiconductor 792 may each include chargecarriers that allow electrons to pass from one semiconductor to another.In the doped n-type semiconductors 792, the charge carriers areelectrons while in doped p-type semiconductors 790, the charge carriersare holes. The diffusion of the charge carriers away from one side maycreate a hot side at the other side of the semiconductor. This buildupof charge carriers at one end created by a voltage potential is directlyproportional to the temperature difference created across thesemiconductor.

For example, the TEG array 734 shown in FIG. 7 may have a first TEGfirst lead 774 that addresses and selectively activates one or a subsetof p-doped 790 and n-doped 792 semiconductor pairs 782 among the p-dopedand n-doped semiconductor pairs 782 formed on the flexible substrate788. In an embodiment, the flexible substrate may be made of apolyimide.

In this embodiment, an additional TEG first lead 774 may also be addedto address and selectively activate one or a subset of p-doped 790 andn-doped semiconductor 792 pairs 782 among the p-doped 790 and n-dopedsemiconductor 792 pairs 782 formed on the flexible substrate 788. Inthis way, a first group of p-doped 790 and n-doped semiconductor 792pairs 782 may be activated to, for example, heat, a portion of thehousing of the thermo-haptic mouse while a second group of p-doped 790and n-doped semiconductor 792 (e.g., TEG pairs 782) on the TEG array 734may be activated to selectively heat or cool that housing at a differentlocation along the surface of the housing.

The TEG array 734 may also include a TEG second lead 784 that allows acircuit to be formed between the TEG array 734 and the TEG driver andmouse controller described herein. Again, where the number of TEG firstleads 774 is increased to addressed specific p-doped 790 and n-dopedsemiconductor 792 pairs 782, the number of TEG second leads 784 is alsoincreased to form those individual circuits to enable more granularaddressing of TEG pairs 782 of the TEG array 734.

FIG. 8 is a flow diagram illustrating a method 800 of activating athermo-haptic mouse according to an embodiment of the presentdisclosure. As described herein, the thermo-haptic mouse may be used forboth input to an information handling system as well as output to theuser in the form of thermo-haptic feedback. This output to the user maybe provided based on events and objects within a gaming environment. Forexample, where the gaming application being executed on the informationhandling system is a first-person shooter gaming application, certainexplosions, gun shots, and interactions with objects within the gamingenvironment may be output as vibrations, heat, or cooling at thethermo-haptic mouse.

The method 800 may begin with a processor receiving gaming action eventenvironment data at block 805. This gaming action event environment datamay be data describing images captured of different game environmentfeatures at different angles. These images may include action that hasor will take place during execution of the gaming application by theprocessor during game play. These captured images may include images ofobjects, actions, or other environmental characteristics that is to beinterpreted by the processor as creating thermo-haptic output to thethermo-haptic mouse. Examples of these objects, actions, or otherenvironmental characteristics are represented in Table 1 herein. In thecontext of, for example, the first-person shooter gaming application, agunshot may produce both acoustic and visual data that is to beinterpreted by the processor as also associated with one or more of amechanical vibrational or thermo feedback to the user at thethermo-haptic mouse. How and when to interpret these objects, actions,or other environmental characteristics as eliciting thermo-hapticfeedback to the user at the thermo-haptic mouse may be determined bytraining a haptic mouse feedback machine learning system and providing,as input, these gaming environment data descriptive of the objects,actions, or other environmental characteristics in order to get specificoutput describing to the processor what feedback is to be provided tothe user at the thermo-haptic mouse. The training of the haptic mousefeedback machine learning system and provision of output from the hapticmouse feedback machine learning system is described herein in moredetail. In other embodiments, the gaming application may be programmedto elicit thermo-haptic feedback during various gaming action eventssuch as the action events shown in Table 1 for example.

At block 810, the method 800 may continue with rendering audio/visualdata from the gaming environment. As briefly mentioned, this may be doneby capturing images of current game play or images from a databasedescribing that game play and determining what objects, actions, orother environmental characteristics should elicit thermo-haptic feedbackat the thermo-haptic mouse. In an alternative embodiment, the gamingapplication may provide thermo-haptic feedback identifications atvarious action points during game play.

The method 800 may continue at blocks 815 and 835 with generatingthermoelectric feedback signals and generating haptic feedback signalsbased on the rendered audio and visual data, respectively. In thisembodiment, the audio and visual data may indicate that the TEG arraysand PEAs should be activated. Again, an example set of parametersregarding if and when the TEG arrays and PEAs should be activated ispresented in Table 1. For example, when a first-person shooter gamingapplication is being executed by the processor, a gun may be used andshot. This specific type of action may create audio and visual output inthe form of an audio spike and a bright flash, respectively. In thisembodiment, both of the audio spike and bright flash may generate haptic(bump, click, vibration) and thermoelectric (heat or cooling) signals atblocks 835 and 815, respectively.

The method 800 may continue with transmitting the generatedthermoelectric feedback signals and haptic feedback signals to the mousecontroller at blocks 820 and 840, respectively. Because the TEG arraysand PEAs may be activated individually, the mouse controller may receiveeither or both of these two types of signals in order to activate theTEG arrays and PEAs independent of each other. In the example where thefirst-person shooter gaming application includes the avatar shooting agun, the thermoelectric feedback may be delayed relative to the haptic(bump, click, or vibration) feedback due to the heat arriving at theavatar later than mechanical response of the gun and an audio wavearriving at the avatar. This would further elicit a more realisticfeedback scenario at the thermo-haptic mouse.

At blocks 825 and 845, the generated thermoelectric feedback signals andthe generated haptic feedback signals may be passed to the TEG arraysand the PEAs, respectively. Again, the timing of the relay of thesesignals, the duration of time the TEG arrays and PEAs are activated, andthe pattern of activation of the TEG arrays and PEAs may be individuallyaddressed by the mouse controller based on the type of feedback isolatedin the haptic signal for the gaming action event. At this point, themethod 800 may end. It is appreciated that the method described inconnection with FIG. 8 may be repeated any number of times as long as agaming application is being executed by the processor of the informationhandling system or when thermo-haptic feedback including mechanicalhaptic feedback or thermo-electric feedback is to be presented to theuser at the thermo-haptic mouse.

FIG. 9 is a flow diagram illustrating a method 900 of training a machinelearning system to control the activation of a thermo-haptic mouseaccording to an embodiment of the present disclosure. The method of FIG.9 may be used when thermo-haptic feedback instructions are not part ofthe gaming application code instructions for example. The method 900 maybegin at block 905 with recording game play over a length of time usingthe processor of the information handling system. During operation theinformation handling system may execute computer code associated with agaming application. This gaming application may be any type of gamingapplication that presents to a user, as visual output, a gamingenvironment. This environment may include any number of objects,actions, or other environmental characteristics as well as, in anembodiment, an avatar. The recorded game play may be descriptive ofthese objects, actions, or other environmental characteristics seen orto be seen by a user. In an embodiment, this recording of game play mayoccur while a user is engaged with actual game play. Additionally, oralternatively, the recording of game play may have already occurred asdemonstrative training data and stored on a database accessible by theprocessor of the information handling system.

The method 900 may also include capturing images of game environmentfeatures and avatars at different angles (e.g., front, back, left side,right side, bottom, and top) and providing a size of the environmentfeatures and avatar at block 910. The images may be a series of stillframe images that depict certain objects, actions, or otherenvironmental characteristics that may affect whether the processor doesor does not provide thermo-haptic feedback to the thermo-haptic mouse.

At block 915, the method 900 may include preparing those captured imagesof the game action event environmental data and avatars into a pluralityof frames at different angles and sizes and label each frame. Again, thein the example where the gaming application is a first-person shootergaming application, the captured images may be of a hand touching snow,an explosion, immersion into water, a gunshot, or getting shot byanother avatar, among other objects, actions, or other environmentalcharacteristics. These captured images may then be prepared and placedinto at a plurality of frames at different angles and sizes with eachframe being labeled for further analysis.

This analysis of the frames created at block 915 may be used as inputinto a haptic mouse feedback machine learning system. At block 920, thecaptured images at block 910 and the frames prepared at block 915 may beprovided as input to the haptic mouse feedback machine learning system.Because the haptic mouse feedback machine learning system may be trainedprior to use, the captured images at block 910 and the frames preparedat block 915 may server to first train the haptic mouse feedback machinelearning system. Later captured images at block 910 and the framesprepared at block 915 may be used as actual input to an inference modelof trained machine learning to receive an intended type of output.

The haptic mouse feedback machine learning system, in an embodiment may,upon execution by the processor, determine such correlations between thecaptured images at block 910 and the frames prepared at block 915 andhaptic feedback to be initiated at the thermo-haptic mouse, in anembodiment, based on any machine learning or neural network methodologyknown in the art or developed in the future. In a specific embodiment,the haptic mouse feedback machine learning system may implement anunsupervised learning or supervised learning technique. For example, thehaptic mouse feedback machine learning system in an embodiment may modelthe relationships between each captured image and action within thegaming environment such as those described in Table 1. The haptic mousefeedback machine learning system may do this using, for example, alayered neural network topology. Such a neural network in an embodimentmay include an input layer including a known, recorded set of values foreach of these parameters, settings, indicators, and image data metrics,and an output layer including an image recognition dataset descriptiveof recognized game action event environmental data during execution ofthe gaming application, based on the known, captured images in the inputlayer at block 930. The haptic mouse feedback machine learning system inan embodiment may propagate input through the layers of the neuralnetwork to project or predict the image recognition datasets based onthe known and recorded images at block 925. Using a back-propagationmethod, the haptic mouse feedback machine learning system, in anembodiment, may then use the captured images to adjust weight matricesof the neural network describing the ways in which image data metricsare likely to affect the image recognition datasets in an embodiment.

At block 925, the processor may provide as output from the machinelearning system image recognition dataset descriptive of recognized gameenvironment features and avatars during game play to a model evaluationsystem. As the number of captured images at block 910 and the preparedframes at block 915 increases for input into the machine learningsystem, the output may become more refined and capable of recognizingthose objects, events, actions, or other environmental characteristicsthat would provide thermo-haptic feedback to the user at thethermo-haptic mouse.

At block 930, the method 900 includes a thermo-haptic feedback modelevaluation system evaluating the accuracy of this image recognitiondataset. The thermo-haptic feedback model evaluation system may becomputer code executed by the processor of the information handlingsystem. The image recognition dataset inference model produced after thetraining of the haptic mouse feedback machine learning system will beused by the processor of the information handling system to providethermo-haptic signals to an array of and one or more to providethermo-haptic feedback commensurate with the game action environmentduring game play. In order to do so, the thermo-haptic feedback modelevaluation system evaluates the accuracy of the image recognitiondataset so that an appropriate level and type of thermo-haptic feedbackis provided to the TEG arrays and PEAs of the thermo-haptic mouse.

At block 935, the model evaluation system determines if the accuracy ofthe image dataset has reached a threshold accuracy. Where, at block 935,the accuracy of the image dataset has not reached a threshold accuracythe method 900 may continue back at block 905 with recording more gameplay and using any data generated therefrom to further train the hapticmouse feedback machine learning system. This may indicate that aninsufficient number of captured images at block 910 and the preparedframes at block 915 were not provided to the machine learning system atblock 920. Where, at block 935, the accuracy of the image dataset hasreached a threshold accuracy the method 900 may continue at block 940.

At block 940, the method 900 may continue with loading and executing theimage recognition dataset with the processor during game play. Thisimage recognition dataset may inform the processor when any objects,actions, or other environmental characteristics indicate that the TEGarrays or PEAs at the thermo-haptic mouse are to be activated. Using thetrained inference model of the machine learning system, this imagerecognition dataset produced after the training of the haptic mousefeedback machine learning system may be used by the processor of theinformation handling system executing to provide thermo-haptic signalsto an array of and one or more to provide thermo-haptic feedbackcommensurate with the game action environment during game play. Thus,the processor may determine when, during gameplay, these objects,actions, or other environmental characteristics have occurred and relaysignals to the thermo-haptic mouse for activation of the TEG arrays andPEAs.

At block 945, the signals produced by the processor at block 940 may beused to activate the thermo-haptic feedback devices in the thermo-hapticmouse such as the TEG arrays and PEAs. This activation may be furthercontrolled by a mouse controller on the thermo-haptic mouse as describedherein. Each of the types of haptic feedback (e.g., heating, cooling,and vibration) may be accomplished according to the type of objects,actions, or other environmental characteristics experienced or engagedwith by the user according to Table 1 above for example. Again, althoughTable 1 describes the activation of the TEG arrays and PEAs duringexecution of a first-person shooter gaming application, the principlesdescribed herein are equally applicable to other types and genres ofgaming applications that may be executed by the processor of theinformation handling system. The present specification contemplatesthese other use-cases and further contemplates that other types ofobject interactions, actions, or other environmental characteristics maybe present to elicit other types of activations of the TEG arrays andPEAs at the thermo-haptic mouse.

FIG. 10 is a flow diagram illustrating a method 1000 of tracking actionon a screen during game play to control the activation of one or moreTEG arrays and PEAs of a thermo-haptic mouse according to an embodimentof the present disclosure. The method 1000 may begin at block of 1005with executing computer program code descriptive of a gaming applicationwith a processor. The gaming application may be any type and genre ofgame that a user may interact with by receiving output from, forexample, a video graphics display and providing input via a keyboard andthe thermo-haptic mouse described herein. Continuing with the exampleprovided herein, the gaming application may be a first-person shootergaming application.

The method 1000 may continue at block 1010 with displaying images ofgame play gaming environment features and, in an embodiment, avatars. Asdescribed herein, the user may interact with the video graphics displayand may be presented with images of a gaming environment. In the contextof the first-person shooter gaming application, the user may see variousobjects and actions that exist and occur within the gaming application.In an embodiment, the avatar may be a full-body view of the avatar or apartial view of the avatar. In accordance with the principles describedherein, the actions that may be presented in this gaming environment mayinclude explosions, gun shots, the avatar being shot, immersion intowater, touching of snow by the avatar, among others. Each of theseobjects, actions, or other environmental characteristics, as well asothers, may be represented as thermo-haptic feedback at thethermo-haptic mouse to the user according to the principles describedherein.

The method 1000 may, at block 1015, continue with processing imagerecognition datasets descriptive of recognized game environment featuresaround the avatars during game play with the processor. As describedherein in connection with FIG. 9, the image recognition dataset may begenerated through the training and use of a haptic mouse feedbackmachine learning system. The process of training and providing input tothe haptic mouse feedback machine learning system in order to receiveoutput in the form of image recognition dataset will not be describedagain here.

With the image recognition dataset, the processor may detect changes tobrightness and rate of change of brightness to detect game play eventsat block 1020 in the method 1000. The detection of the changes inbrightness may be detected using any type of computer implemented objectrecognition process, any color and object identification process, and/orany image detection process that may recognize changes or spikes inbrightness within one or more frames of the gaming environment. Forexample, in the first-person shooter gaming application, an explosionmay be represented with a bright and large flash of white, yellow, red,and/or orange colors. In this example, the processor may detect thesecolors or images and determine that an explosion has occurred. A rate ofchange among a plurality of frames of the image recognition dataset mayalso be considered in order to determine, for example, a rate of changeof the images to, for example, determine the velocity of the explosionas well as the size of the explosion. These additional measurements maybe used to further determine how the TEG arrays and PEAs within thethermo-haptic mouse are to be activated by the mouse controller andprocessor of the information handling system.

The method 1000 may also include determining the distance of thebrightness from the avatar using the size measurement at block 1025. Theprocessor, in this embodiment, may also use any calculation such as thePythagorean theorem to determine perspectives of these relative sizesand distances. In an embodiment, the processor may also determine adirectionality of the brightness (e.g., towards avatar or away fromavatar).

Along with the brightness and size of the event (e.g., the explosion)being determined by the processor, the method 1000 may further includedetecting changes in an amplitude of the audio to detect additionalenvironmental feature changes at block 1030. In this embodiment, theaudio output from the execution of the gaming application may causenoises at certain volumes to be provided to the user via, for example,speakers of the information handling system. This audio data may includevarious tones, frequencies, pitch, and ranges that define the sound ofan explosion. The processor may analyze these sounds and detect thesound of the explosion in order to further provide output via the TEGarrays and PEAs at the thermo-haptic mouse.

The method 1000 may further include generating thermo and hapticfeedback signals with the processor at block 1035. As described herein,certain object interactions, actions, or other environmentalcharacteristics may elicit different thermo-haptic signals upon input toa trained inference model for determining thermo-haptic feedback.Example thermo-haptic feedback signals are represented in Table 1. Thethermo-haptic signals described in Table 1 may be specificallyapplicable to the first-person shooter gaming application describedherein as an example and may be a result of a trained machine learninginference model for game action event environment for a particulargaming application. However, the execution of other gaming applicationsmay elicit different intensities and patterns of activation of the TEGarrays and PEAs along with those presented in Table 1. Such othergenerated thermo-haptic signals are contemplated in the presentspecification.

The method 1000 may include, at 1040, activating the TEG arrays and PEAsof the thermo-haptic mouse according to the thermo-haptic signalsgenerated by the processor. Again, the signals generated by theprocessor may be transmitted, either wirelessly or via a wire, to themouse controller of the thermo-haptic mouse which may relay thesesignals to one or more TEG arrays or PEA. The duration of activation andtiming of the activation of the TEG arrays and PEAs may vary based onthe type of signal provided to the mouse controller according to, forexample, Table 1. In an embodiment, the signals may indicate a singleevent thermo-haptic feedback, directional thermo-haptic feedback, ormoving thermo-haptic feedback according to various embodiments. Thenature of the haptic or thermo-electric feedback signals is a result ofthe game play images processed via the trained machine learninginference model for the specific gaming applications according to someembodiments. At this point the method 1000 may end. The presentspecification contemplates that the method 1000 may be iterativelyexecuted when the processor is provided with any image recognitiondatasets as described herein and may not stop until execution of thegaming application is stopped.

The blocks of the flow diagrams of FIGS. 8 through 10 or steps andaspects of the operation of the embodiments herein and discussed hereinneed not be performed in any given or specified order. It iscontemplated that additional blocks, steps, or functions may be added,some blocks, steps or functions may not be performed, blocks, steps, orfunctions may occur contemporaneously, and blocks, steps or functionsfrom one flow diagram may be performed within another flow diagram.

Devices, modules, resources, or programs that are in communication withone another need not be in continuous communication with each other,unless expressly specified otherwise. In addition, devices, modules,resources, or programs that are in communication with one another cancommunicate directly or indirectly through one or more intermediaries.

Although only a few exemplary embodiments have been described in detailherein, those skilled in the art will readily appreciate that manymodifications are possible in the exemplary embodiments withoutmaterially departing from the novel teachings and advantages of theembodiments of the present disclosure. Accordingly, all suchmodifications are intended to be included within the scope of theembodiments of the present disclosure as defined in the followingclaims. In the claims, means-plus-function clauses are intended to coverthe structures described herein as performing the recited function andnot only structural equivalents, but also equivalent structures.

The subject matter described herein is to be considered illustrative,and not restrictive, and the appended claims are intended to cover anyand all such modifications, enhancements, and other embodiments thatfall within the scope of the present invention. Thus, to the maximumextent allowed by law, the scope of the present invention is to bedetermined by the broadest permissible interpretation of the followingclaims and their equivalents and shall not be restricted or limited bythe foregoing detailed description.

What is claimed is:
 1. An information handling system, comprising: aprocessor; a data storage device; a power management unit; athermo-haptic mouse, including: an array of thermoelectric generators ofa thermo-haptic module to selectively heat or cool a portion of thethermo-haptic mouse to be felt by a user of the thermo-haptic mouse; anda piezoelectric actuator of the thermo-haptic module to selectivelyapply a vibration to the portions of the thermo-haptic mouse to be feltby the user of the thermo-haptic mouse; and the processor executing codeof a mouse training machine learning system to: receive, as traininginput, captured images during the execution of a gaming application; andprovide, as output, image recognition dataset descriptive of recognizedgame action event environmental data during execution of the gamingapplication, the image recognition dataset to be used by the processorexecuting a thermo-haptic feedback model evaluation system to providethermo-haptic signals to the array of thermoelectric generators and thepiezoelectric actuator to provide thermo-haptic feedback commensuratewith the game action event environment during game play.
 2. Theinformation handling system of claim 1, wherein the execution of thethermo-haptic feedback model evaluation system by the processordetermines if a threshold accuracy of the output image recognitiondataset has been reached before use of the output image recognitiondataset by the processor for thermo-haptic feedback during execution ofthe gaming application.
 3. The information handling system of claim 1,wherein the array of thermoelectric generators arranged within aninterior of a portion of the thermo-haptic mouse provide a plurality ofhot or cold thermal zones across a surface of the thermo-haptic mouse tobe touched by the user when actuated.
 4. The information handling systemof claim 1, wherein the array of thermoelectric generators includes aflexible substrate to allow the thermoelectric generators to contouragainst an interior surface of a housing of the thermo-haptic mouse as apalm rest to be held by the user.
 5. The information handling system ofclaim 1, further comprising: pairing a piezoelectric actuator with thearray of thermoelectric generators in the thermo-haptic module, thepiezoelectric actuator being placed below the array of thermoelectricgenerators sandwiching the thermoelectric generators between thepiezoelectric actuators and an interior surface of a housing of thethermo-haptic mouse.
 6. The information handling system of claim 1, thethermo-haptic mouse further comprising: a dedicated printed circuitboard including a thermoelectric driver for the array of thermoelectricgenerators and a piezoelectric actuator driver for the piezoelectricactuator, the thermoelectric drivers and piezoelectric drivers operatingvia a controller on a mouse printed circuit board to receive thethermo-haptic signals.
 7. The information handling system of claim 1,wherein each thermoelectric generator in the array of thermoelectricgenerators further comprises a series of p-doped and n-dopedsemiconductors to receive a voltage to selectively heat or cool one ormore of the semiconductors.
 8. A thermo-haptic feedback pointing deviceoperatively coupled to an information handling system, comprising: atleast one input button; a housing including a palm rest housing; and amotion tracking system to track movement of the thermo-haptic feedbackpointing device; a controller to receive haptic feedback data from aprocessor of the information handling system; a thermoelectric driveroperatively coupled to an array of thermoelectric generators to receivesignals from the controller to selectively heat or cool portions of thethermo-haptic feedback pointing device to be felt by the user of thethermo-haptic feedback pointing device, the plurality of thermoelectricgenerators including a flexible substrate to allow the plurality ofthermoelectric generators to contour against an interior surface of thepalm rest housing of the thermo-haptic feedback pointing device; and apiezoelectric driver operatively coupled to a piezoelectric actuator toselectively apply a mechanical haptic feedback to the portions of thethermo-haptic feedback pointing device to be felt by the user of thethermo-haptic feedback pointing device; wherein the thermo-hapticfeedback pointing device receives instructions to activate thepiezoelectric actuator and array of thermoelectric generatorscorresponding to game action events of an executing gaming applicationoriginating from a haptic feedback machine learning system.
 9. Thethermo-haptic feedback pointing device of claim 8, further comprising:pairing of a piezoelectric actuator to each array of thermoelectricgenerators, the piezoelectric actuator being placed below each array ofthermoelectric generators sandwiching the array of thermoelectricgenerators between the piezoelectric actuator and an interior surface ofthe palm rest housing of the thermo-haptic feedback pointing device. 10.The thermo-haptic feedback pointing device of claim 8, furthercomprising: a dedicated printed circuit board including a plurality ofthermoelectric drivers for each of the array of thermoelectricgenerators to render a thermo-haptic feedback across a plurality ofarrays of thermoelectric generators.
 11. The thermo-haptic feedbackpointing device of claim 8, further comprising: a dedicated printedcircuit board including a plurality of piezoelectric actuator driversfor each of a plurality of piezoelectric actuators to render a vibrationhaptic feedback across a plurality of piezoelectric actuators.
 12. Thethermo-haptic feedback pointing device of claim 8, further comprising awired connection with the information handling system, the wiredconnection including signal and power lines to the controller of thethermo-haptic feedback pointing device.
 13. The thermo-haptic feedbackpointing device of claim 8, wherein the instructions to thethermo-haptic feedback pointing device originates from a haptic feedbackmachine learning system.
 14. The thermo-haptic feedback pointing deviceof claim 8, further comprising: forming discrete heat and cold zones ona surface the housing of the thermo-haptic feedback pointing device byarranged plurality of arrays of thermoelectric generators against theinterior surface of a palm rest housing of the thermo-haptic feedbackpointing device to heat and cool one or more of the discrete heat andcold zones.
 15. A thermo-haptic feedback pointing device operativelycoupled to an information handling system, comprising: at least oneinput button; a housing including a palm rest housing; and a motiontracking system to track movement of the thermo-haptic feedback pointingdevice; a controller to receive haptic feedback data from a processor ofthe information handling system; a thermoelectric driver operativelycoupled to an array of thermoelectric generator to receive signals fromthe controller to selectively heat or cool portions of the thermo-hapticfeedback pointing device to be felt by the user of the thermo-hapticfeedback pointing device corresponding to the haptic feedback data, theplurality of thermoelectric generators including a flexible substrate toallow the plurality of thermoelectric generators to contour against aninterior surface of the palm rest housing of the thermo-haptic feedbackpointing device; and a piezoelectric driver operatively coupled to apiezoelectric actuator to selectively apply a mechanical haptic feedbackto the portions of the thermo-haptic feedback pointing device to be feltby the user of the thermo-haptic feedback pointing device correspondingto the haptic feedback data; a dedicated printed circuit boardincluding: a plurality of thermoelectric drivers for each of a pluralityof arrays of thermoelectric generators to render the selective heatingor cooling across a plurality of arrays of thermoelectric generators;and a plurality of piezoelectric actuator drivers for each of aplurality of piezoelectric actuators to render the mechanical hapticfeedback across a plurality of piezoelectric actuators.
 16. Thethermo-haptic feedback pointing device of claim 15, further comprising:pairing of a piezoelectric actuator to each array of thermoelectricgenerators, the piezoelectric actuator being placed below each array ofthermoelectric generators sandwiching the array of thermoelectricgenerators between the piezoelectric actuator and an interior surface ofthe palm rest housing of the thermo-haptic feedback pointing device. 17.The thermo-haptic feedback pointing device of claim 15, furthercomprising a wired connection with the information handling system, thewired connection including signal and power lines to the controller ofthe thermo-haptic feedback pointing device.
 18. The thermo-hapticfeedback pointing device of claim 15, further comprising: a wirelesstransceiver to send and receive data from the information handlingsystem; and a battery to power the controller, thermoelectricgenerators, and piezoelectric actuators.
 19. The thermo-haptic feedbackpointing device of claim 15, wherein discrete heat and cold zones areformed on a surface of the palm rest housing of the thermo-hapticfeedback pointing device by arranging the plurality of thermoelectricgenerators against an interior surface of the housing of thethermo-haptic feedback pointing device to concurrently heat and cool oneor more of the discrete hot and cold zones.
 20. The thermo-hapticfeedback pointing device of claim 15, wherein the thermo-haptic feedbackpointing device receives instructions to activate the piezoelectricactuator and array of thermoelectric generators originating from ahaptic feedback machine learning system inference model.